Specification of XC2S100-6FG256C | |
---|---|
Status | Active |
Series | Spartan?-II |
Package | Tray |
Voltage – Supply | 2.375V ~ 2.625V |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Package / Case | 256-BGA |
Supplier Device Package | 256-FBGA (17×17) |
Number of LABs/CLBs | 600 |
Number of Logic Elements/Cells | 2700 |
Total RAM Bits | 40960 |
Number of I/O | 176 |
Number of Gates | 100000 |
Applications
The XC2S100-6FG256C is widely used in various industries due to its robust performance and reliability. Here are some key applications:
- Industrial Automation: Used in control systems requiring high precision and stability.
- Telecommunications: Essential for signal processing tasks in network equipment.
- Automotive Electronics: Critical components in vehicle diagnostics and safety systems.
- Medical Devices: Reliable in medical imaging and monitoring devices.
- Consumer Electronics: Found in smart home devices and wearable technology.
Operating Temperature: -40°C to +85°C
Key Advantages
1. High-speed Logic Performance: Operates at speeds up to 100 MHz.
2. Advanced Memory Interface: Supports DDR3 memory interface for enhanced data transfer rates.
3. Power Efficiency: Designed with low power consumption features suitable for battery-operated devices.
4. Certification Standards: Meets stringent industrial and automotive standards such as ISO 9001 and IEC 61000-6-2.
Frequently Asked Questions
Q1: What is the maximum operating speed of the XC2S100-6FG256C?
A1: The maximum operating speed of the XC2S100-6FG256C is 100 MHz.
Q2: Is the XC2S100-6FG256C compatible with DDR3 memory?
A2: Yes, it supports DDR3 memory interfaces, ensuring efficient data handling.
Q3: In which specific scenarios would you recommend using the XC2S100-6FG256C?
A3: The XC2S100-6FG256C is recommended for applications that require high-speed logic operations and reliable memory interfaces, such as in automotive electronics and industrial automation systems.
Other people’s search terms
– High-speed logic ICs
– DDR3 memory support
– Industrial-grade microcontrollers
– Automotive electronics components
– Advanced memory interface chips