Objective
This article provides engineers with a concise, data-verified comparison of three widely-used Xilinx Spartan-6 FPGAs—XA6SLX45T, XA6SLX75T, and XC6SLX150—to enable rapid, risk-free device selection for industrial, communication, and image-processing projects.
Validated Specification Matrix
| Parameter | XA6SLX45T | XA6SLX75T | XC6SLX150 |
|---|---|---|---|
| LUTs | 43 661 | 74 637 | 147 443 |
| Flip-Flops | 54 576 | 93 296 | 184 304 |
| Block RAM (Kb) | 2 088 | 3 096 | 4 824 |
| DSP48A1 Slices | 58 | 132 | 180 |
| GTP Transceivers | 0 | 8 | 0 |
| Temperature Grade | –40 °C to +100 °C | –40 °C to +100 °C | 0 °C to +85 °C |
| Core Voltage (VCCINT) | 1.2 V nominal | 1.2 V nominal | 1.2 V nominal |
| Typical Package | FGG484 | FGG484 | FGG676/FGG1156 |
| Tool Support | ISE 14.7 | ISE 14.7 | ISE 14.7 |
Data confirmed against AMD (formerly Xilinx) DS162 and LX45T/75T/150 product specification tables.
When to Choose Which Device
| Application Scenario | Recommended Device | Key Justification |
|---|---|---|
| Industrial motor control, PLCs | XA6SLX45T | Lowest cost, adequate DSP, –40 °C start-up |
| Serial bridging (PCIe Gen1, Aurora) | XA6SLX75T | 8 × 3.2 Gb/s GTP lanes, industrial temp |
| High-resolution image preprocessing | XC6SLX150 | Maximum LUT/RAM/DSP for parallel pipelines |
| Outdoor or unheated enclosures | XA series | Industrial-grade silicon & packaging |
Design & Procurement Notes
- Tool Chain: All variants are locked to ISE 14.7; Vivado is not supported.
- Configuration: Use 1.8–3.3 V SPI NOR flash (e.g., Cypress S25FL256S) or Xilinx XCF32P.
- Power Sequencing: VCCINT → VCCAUX → VCCO per DS162; monitor in-rush current in cold-start conditions.
- Package Routing: XC6SLX150 FGG1156 requires ≥8-layer PCB and 5 mil trace/space; XA devices in FGG484 allow 6-layer stack-up.
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