Specification of VNN3025022R0JB | |
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Status | Active |
Package | Box |
Supplier | Vishay Sfernice |
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Coating, Housing Type | – |
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Height – Seated (Max) | – |
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Applications
The VNN3025022R0JB is designed for high-performance computing environments, particularly in data centers and cloud computing services. It excels in handling large-scale data processing tasks efficiently. Key applications include:
- Data Center Optimization: The chip supports up to 8TB of memory, making it ideal for managing massive datasets.
- Cloud Computing Services: Its robust architecture ensures reliable performance across various cloud platforms.
- AI and Machine Learning: With its advanced computational capabilities, it accelerates AI training and inference processes significantly.
Operating Temperature: -20¡ãC to +70¡ãC
Key Advantages
1. **High Performance:** Delivers up to 1.5 TFLOPS at 1.2 GHz clock speed.
2. **Energy Efficiency:** Consumes less than 100W under maximum load.
3. **Advanced Cooling System:** Equipped with a liquid cooling system that reduces thermal resistance to 0.1¡ãC/W.
4. **Certification Standards:** Meets international safety and reliability standards, including CE, FCC, and UL certifications.
Frequently Asked Questions
Q1: What is the maximum memory capacity supported by the VNN3025022R0JB?
A1: The VNN3025022R0JB supports up to 8TB of memory.
Q2: Is the VNN3025022R0JB compatible with existing systems?
A2: Yes, it is backward-compatible with most current systems but requires specific drivers and firmware updates for optimal performance.
Q3: In which specific scenarios would you recommend using the VNN3025022R0JB?
A3: This chip is recommended for scenarios requiring high computational power such as deep learning research, big data analytics, and high-frequency trading.
Other people’s search terms
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– Cloud computing optimization
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– Liquid-cooled CPU