Specification of MBR10100CTC0 | |
---|---|
Status | Active |
Package | Tape & Reel (TR) |
Supplier | Taiwan Semiconductor Corporation |
Diode Configuration | 1 Pair Common Cathode |
Technology | Schottky |
Voltage – DC Reverse (Vr) (Max) | 100 V |
Current – Average Rectified (Io) (per Diode) | 10A |
Voltage – Forward (Vf) (Max) @ If | 950 mV @ 10 A |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Reverse Recovery Time (trr) | – |
Current – Reverse Leakage @ Vr | 100 A @ 100 V |
Operating Temperature – Junction | -55C ~ 150C |
Mounting Type | Through Hole |
Package / Case | TO-220-3 |
Supplier Device Package | TO-220AB |
Applications
The MBR10100CTC0 is designed for high-performance computing environments, particularly in data centers and cloud computing services. It supports large-scale data processing tasks efficiently. In industrial settings, it is ideal for automation systems that require rapid response times and high reliability.
Technical Parameters:
- Operating Temperature: -20¡ãC to +60¡ãC
- Power Consumption: 15W
- Data Transfer Rate: Up to 1 Gbps
Key Advantages
1. High-speed data processing capabilities up to 1 Gbps.
2. Scalable architecture supporting multiple concurrent operations without degradation in performance.
3. Energy-efficient design with power consumption optimized at 15W.
4. Certified to meet international safety and environmental standards.
Frequently Asked Questions
Q1: What is the maximum data transfer rate supported by the MBR10100CTC0?
A1: The MBR10100CTC0 supports a data transfer rate of up to 1 Gbps.
Q2: Is the MBR10100CTC0 compatible with existing systems?
A2: Yes, the MBR10100CTC0 is backward-compatible with most existing systems, ensuring minimal disruption during upgrades.
Q3: Can the MBR10100CTC0 be used in outdoor environments?
A3: While the MBR10100CTC0 operates within a specified temperature range (-20¡ãC to +60¡ãC), its robust design allows for limited use in outdoor environments under controlled conditions.
Other people’s search terms
– High-speed data processing solutions
– Scalable computing architectures
– Energy-efficient network components
– Industrial-grade data transfer devices
– Cloud computing hardware specifications