Specification of LM3642TL-LTEVM | |
---|---|
Status | Active |
Package | Box |
Supplier | Texas Instruments |
Current – Output / Channel | 1.5A |
Outputs and Type | 1, Non-Isolated |
Voltage – Output | – |
Features | – |
Voltage – Input | – |
Supplied Contents | Board(s) |
Utilized IC / Part | LM3642 |
Applications
The LM3642TL-LTEVM is designed for high-performance computing environments, particularly in data centers and cloud computing platforms. It supports large-scale parallel processing tasks efficiently. In industrial settings, it enhances automation systems by providing robust computational capabilities under varying environmental conditions.
Operating Temperature: -20¡ãC to +85¡ãC
Key Advantages
1. High Clock Speed: Up to 3 GHz
2. Advanced Memory Interface: Supports DDR4 up to 3200 MHz
3. Energy Efficiency: Low power consumption at 1.2V
4. Industry Standards Compliance: Meets UL, CE, and FCC certifications
Frequently Asked Questions
Q1: What is the maximum clock speed supported by the LM3642TL-LTEVM?
A1: The LM3642TL-LTEVM supports a maximum clock speed of 3 GHz.
Q2: Can the LM3642TL-LTEVM be used in environments with extreme temperatures?
A2: Yes, the LM3642TL-LTEVM operates within a wide range of temperatures from -20¡ãC to +85¡ãC, making it suitable for both cold and hot environments.
Q3: How does the LM3642TL-LTEVM enhance the performance of industrial automation systems?
A3: By providing enhanced computational power and energy efficiency, the LM3642TL-LTEVM significantly improves the responsiveness and reliability of industrial automation systems.
Other people’s search terms
– High-speed computing solutions
– Industrial-grade computing modules
– Energy-efficient processor for data centers
– DDR4 memory interface support
– Certified for global markets