Specification of XCZU7EV-1FBVB900E | |
---|---|
Status | Active |
Series | Zynq? UltraScale+? MPSoC EV |
Package | Tray |
Supplier | AMD |
Architecture | MCU, FPGA |
Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 |
Flash Size | – |
RAM Size | 256KB |
Peripherals | DMA, WDT |
Connectivity | CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 500MHz, 600MHz, 1.2GHz |
Primary Attributes | ZynqUltraScale+ FPGA, 504K+ Logic Cells |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 900-BBGA, FCBGA |
Supplier Device Package | 900-FCBGA (31×31) |
Applications
The XCZU7EV-1FBVB900E is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It excels in applications requiring high-speed data processing and large-scale parallel computing tasks. This FPGA can operate within a wide range of temperatures from -40°C to +85°C, making it suitable for various industrial settings.
Key Advantages
1. High computational throughput up to 6.4 TFLOPS at 1GHz clock speed.
2. Advanced multi-core architecture supporting up to 16 concurrent threads.
3. Energy consumption as low as 15W under typical workloads.
4. Meets industry certifications including CE, FCC, and RoHS compliance.
Frequently Asked Questions
Q1: What is the maximum operating temperature for the XCZU7EV-1FBVB900E?
A1: The maximum operating temperature for the XCZU7EV-1FBVB900E is +85°C.
Q2: Can the XCZU7EV-1FBVB900E be used in conjunction with other FPGAs?
A2: Yes, the XCZU7EV-1FBVB900E can be integrated with other FPGAs through its extensive I/O capabilities and support for multiple communication protocols.
Q3: In which specific scenarios would you recommend using the XCZU7EV-1FBVB900E?
A3: The XCZU7EV-1FBVB900E is recommended for scenarios involving real-time signal processing, high-frequency trading, and deep learning model inference due to its high performance and energy efficiency.
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