Specification of XCZU6EG-3FFVC900E | |
---|---|
Status | Active |
Series | Zynq? UltraScale+? MPSoC EG |
Package | Tray |
Architecture | MCU, FPGA |
Core Processor | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? |
Flash Size | – |
RAM Size | 256KB |
Peripherals | DMA, WDT |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 600MHz, 1.5GHz |
Primary Attributes | Zynq?UltraScale+? FPGA, 469K+ Logic Cells |
Operating Temperature | 0¡ãC ~ 100¡ãC (TJ) |
Package / Case | 900-BBGA, FCBGA |
Supplier Device Package | 900-FCBGA (31×31) |
Number of I/O | 204 |
Applications
The XCZU6EG-3FFVC900E is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It supports applications requiring high-speed data processing and large-scale parallel computing tasks. Key technical parameters include operating temperatures ranging from -40¡ãC to +85¡ãC.
Key Advantages
1. High clock speed up to 700 MHz
2. Advanced multi-core architecture supporting over 1 million logic cells
3. Energy-efficient design with power consumption optimized at 1.2 W per logic cell
4. Meets industry-standard certifications including ISO 9001 and CE marking
Frequently Asked Questions
Q1: What is the maximum clock speed supported by the XCZU6EG-3FFVC900E?
A1: The XCZU6EG-3FFVC900E supports a maximum clock speed of 700 MHz.
Q2: Can the XCZU6EG-3FFVC900E be used in environments with extreme temperatures?
A2: Yes, it operates within a wide range of temperatures from -40¡ãC to +85¡ãC, making it suitable for various industrial applications.
Q3: In which specific scenarios would the XCZU6EG-3FFVC900E be most beneficial?
A3: The XCZU6EG-3FFVC900E is particularly beneficial in scenarios requiring high computational performance, such as deep learning models, big data analytics, and high-frequency trading systems.
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