Specification of XCVU3P-1FFVC1517I | |
---|---|
Status | Active |
Series | Virtex? UltraScale+? |
Package | Tray |
Voltage – Supply | 0.825V ~ 0.876V |
Mounting Type | Surface Mount |
Operating Temperature | -40¡ãC ~ 100¡ãC (TJ) |
Package / Case | 1517-BBGA, FCBGA |
Supplier Device Package | 1517-FCBGA (40×40) |
Number of LABs/CLBs | 49260 |
Number of Logic Elements/Cells | 862050 |
Total RAM Bits | 130355200 |
Number of I/O | 520 |
Applications
The XCVU3P-1FFVC1517I is ideal for high-performance computing environments such as data centers and cloud computing platforms. It excels in applications requiring fast processing speeds and large-scale parallel computing tasks. Additionally, it is suitable for automotive electronics systems that demand robust performance under varying conditions.
Key Advantages
1. Operating Temperature Range: -40¡ãC to +85¡ãC
2. Unique Architecture Feature: Advanced multi-core processing capabilities
3. Power Efficiency Data: Achieves up to 90% power efficiency at peak performance
4. Certification Standards: Meets international safety and reliability standards
Frequently Asked Questions
Q1: What is the maximum clock frequency supported by the XCVU3P-1FFVC1517I?
A1: The XCVU3P-1FFVC1517I supports a maximum clock frequency of 600 MHz.
Q2: Is the XCVU3P-1FFVC1517I compatible with existing hardware?
A2: Yes, the XCVU3P-1FFVC1517I is backward-compatible with most existing hardware interfaces and can be integrated into new designs without significant modifications.
Q3: In which specific scenarios would you recommend using the XCVU3P-1FFVC1517I?
A3: The XCVU3P-1FFVC1517I is recommended for scenarios involving real-time data processing, high-speed network communications, and complex algorithmic computations.
Other people’s search terms
– High-performance computing solutions
– Automotive electronics components
– Cloud computing hardware
– Multi-core processor technology
– Energy-efficient processors