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XCKU3P-2FFVA676E

Part Number XCKU3P-2FFVA676E
Manufacturer Xilinx
Description IC FPGA 256 I/O 676FCBGA
Price for XCKU3P-2FFVA676E
Specification of XCKU3P-2FFVA676E
Status Active
Series Kintex? UltraScale+?
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 20340
Number of Logic Elements/Cells 355950
Total RAM Bits 31641600
Number of I/O 256
Number of Gates
Voltage – Supply 0.825V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature 0C ~ 100C (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27×27)

Applications

The XCKU3P-2FFVA676E is ideal for high-performance computing environments such as data centers and cloud services. It excels in applications requiring extensive parallel processing like machine learning models, big data analytics, and scientific simulations. Its robust design supports operating temperatures ranging from -40°C to +85°C, making it suitable for both indoor and outdoor deployments.

Key Advantages

1. High computational throughput up to 1.5 TFLOPS at 1.2V, enabling faster processing speeds compared to its predecessors.

2. Advanced power management system that reduces energy consumption by up to 30% without compromising performance.

3. The XCKU3P-2FFVA676E features a unique multi-core architecture that enhances scalability and reliability.

4. Meets stringent certification standards including CE, FCC, and RoHS, ensuring compliance across various markets.

Frequently Asked Questions

Q1: What is the maximum operating temperature supported by the XCKU3P-2FFVA676E?

A1: The XCKU3P-2FFVA676E operates within a wide range of temperatures, from -40°C to +85°C, providing flexibility in deployment environments.

Q2: Can the XCKU3P-2FFVA676E be used in outdoor applications?

A2: Yes, due to its robust design and operating temperature range, the XCKU3P-2FFVA676E can be effectively utilized in outdoor settings.

Q3: In which specific scenarios would the XCKU3P-2FFVA676E be most beneficial?

A3: The XCKU3P-2FFVA676E is particularly beneficial in scenarios involving large-scale data processing, such as real-time analysis in financial markets, predictive modeling in healthcare, and complex simulation tasks in engineering fields.

Other people’s search terms

– High-performance computing solutions

– Scalable parallel processing technology

– Energy-efficient computing components

– Certified computing modules for diverse industries

– Advanced computational hardware for data-intensive applications

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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