| Specification of XC6VLX130T-2FF1156I | |
|---|---|
| وضعیت | فعال |
| سری | Virtex?-6 LXT |
| بسته‌بندی | سینی |
| تامین کننده | AMD |
| قابل برنامه‌ریزی Digi-Key | تأیید نشده |
| تعداد LAB/CLB ها | 10000 |
| تعداد عناصر/سلول‌های منطقی | 128000 |
| کل بیت‌های RAM | 9732096 |
| تعداد ورودی/خروجی | 600 |
| تعداد گیت‌ها | – |
| ولتاژ تغذیه | 0.95V ~ 1.05V |
| نوع نصب | نصب سطحی |
| دمای عملیاتی | -40C ~ 100C (TJ) |
| بسته‌بندی / محفظه | 1156-BBGA, FCBGA |
| بسته‌بندی دستگاه تامین کننده | 1156-FCBGA (35×35) |
کاربردها
The XC6VLX130T-2FF1156I is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in applications such as artificial intelligence training, big data analytics, and cloud computing services. This device operates within a wide range of temperatures from -40¡ãC to +85¡ãC, ensuring reliability across various environmental conditions.
مزایای کلیدی
1. High clock speed up to 750 MHz, providing superior computational performance.
2. Advanced memory interface supporting DDR4 at speeds up to 2666 MT/s, enhancing data throughput.
3. Energy-efficient design with power consumption optimized for extended operation without overheating.
4. Meets stringent industrial standards including CE, FCC, and RoHS certifications.
سؤالات متداول
Q1: Can the XC6VLX130T-2FF1156I be used in high-temperature environments?
A1: Yes, it can operate effectively between -40¡ãC and +85¡ãC, making it suitable for both indoor and outdoor applications.
Q2: What are the specific memory interfaces supported by the XC6VLX130T-2FF1156I?
A2: The device supports DDR4 memory with a maximum bandwidth of 2666 MT/s, which is beneficial for high-speed data processing tasks.
Q3: In which industries is the XC6VLX130T-2FF1156I commonly utilized?
A3: Commonly used in sectors like telecommunications, automotive electronics, and financial services where high-performance computing and data analysis are critical.
عبارات جستجوی افراد دیگر
– راه حل‌های محاسباتی با کارایی بالا
– DDR4 memory support devices
– Industrial-grade computing modules
– Energy-efficient computing platforms
– AI hardware accelerators
