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XC3S1500-4FGG456I

Part Number XC3S1500-4FGG456I
Manufacturer Xilinx
Description IC FPGA 333 I/O 456FBGA
Price for XC3S1500-4FGG456I
Specification of XC3S1500-4FGG456I
Status Active
Series Spartan?-3
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 3328
Number of Logic Elements/Cells 29952
Total RAM Bits 589824
Number of I/O 333
Number of Gates 1500000
Voltage – Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40C ~ 100C (TJ)
Package / Case 456-BBGA
Supplier Device Package 456-FBGA (23×23)

Applications

The XC3S1500-4FGG456I is ideal for high-performance computing environments due to its robust processing capabilities. It excels in server farms where it can handle complex data processing tasks efficiently. Additionally, it is suitable for automotive applications requiring precise control systems, such as advanced driver assistance systems (ADAS). In industrial settings, it supports automation processes that demand reliability and speed. The device operates within a wide temperature range from -40°C to +85°C, making it suitable for various environmental conditions.

Key Advantages

1. Processing Speed: Up to 150 MHz clock rate enabling fast execution of complex algorithms.

2. Advanced Memory Interface: Supports up to 1 Gbps memory bandwidth enhancing data transfer rates.

3. Low Power Consumption: Designed with power-efficient architecture reducing energy usage significantly.

4. Industry Certifications: Meets stringent safety and quality standards ensuring reliable performance in critical applications.

Frequently Asked Questions

Q1: Can the XC3S1500-4FGG456I be used in high-temperature environments?

A1: Yes, it operates effectively between -40°C and +85°C, making it suitable for both cold and hot climates.

Q2: What are the compatibility requirements for this chip?

A2: The XC3S1500-4FGG456I is compatible with standard industry interfaces and can integrate seamlessly into existing hardware setups without major modifications.

Q3: How does this chip perform under heavy load conditions?

A3: Under heavy load, the XC3S1500-4FGG456I maintains high performance levels while managing heat efficiently through its cooling design.

Other people’s search terms

– High-speed processing solutions

– Automotive-grade microprocessors

– Industrial automation processors

– Energy-efficient computing devices

– Advanced memory interface technology

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

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Global Logistics
Global logistics are available for delivery
B2B Sales
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24/7 Support
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