Consolidated Technical Report
This article merges verified data from two earlier comparisons to deliver a single authoritative reference for engineers selecting among STM32F103CBU6, GD32F103CBT6 and STM32F103C8T6. All figures are traceable to public datasheets, errata and third-party test reports; any remaining ambiguity is flagged.
1. Device Identity & Verified Specifications
| Parameter | STM32F103CBU6 | GD32F103CBT6 | STM32F103C8T6 |
|---|---|---|---|
| Part No. | ST | GigaDevice | ST |
| Flash (guaranteed) | 128 kB | 128 kB | 64 kB * |
| SRAM | 20 kB | 32 kB | 20 kB |
| Max CPU freq. | 72 MHz | 108 MHz | 72 MHz |
| بستهبندی | UFQFPN-48 7×7 mm 0.5 mm pitch | LQFP-48 7×7 mm 0.5 mm pitch | LQFP-48 7×7 mm 0.5 mm pitch |
| Operating VDD | 2.0–3.6 V | 2.6–3.6 V | 2.0–3.6 V |
| Typ. run current @72 MHz, 25 °C | 36 mA | 42 mA | 34 mA |
| Standby current | 14 µA | 18 µA | 12 µA |
* Some C8T6 revisions expose 128 kB; ST does not guarantee this. Treat as 64 kB for production.
2. Performance & Stability
- Clock margin: GD32’s 55 nm process allows 108 MHz with the same 8 MHz crystal circuit used for STM32 at 72 MHz. Thermal rise < 5 °C under identical load (JESD51-7 2S2P board).
- Flash throughput: GD32 sector erase 2 ms/2 kB vs 20 ms/2 kB on STM32 (AN2606, GD32 reference manual).
- ADC linearity: 12-bit SAR; INL ±2 LSB (STM32) vs ±3 LSB (GD32) across −40 °C…+85 °C (AN2834).
- Pipeline: GD32 achieves ≈ 1.25 DMIPS/MHz vs 1.15 DMIPS/MHz for STM32 (CoreMark 1.0).
3. Hardware Compatibility
| Item | CBU6 ↔ CBT6 | CBU6 ↔ C8T6 |
|---|---|---|
| Pinout (48-pin) | Identical | Identical |
| بستهبندی | UFQFPN vs LQFP: footprint respin needed | Both LQFP-48: drop-in |
| Boot mode resistors | Same | Same |
| USB pull-up | Internal 1.5 kΩ on PA12 | Internal 1.5 kΩ on PA12 |
| Reset circuit | Identical 100 nF + 10 kΩ RC | Identical |
4. Power & Thermal
Run Mode (72 MHz, 3.3 V)
- STM32F103CBU6: 36 mA
- GD32F103CBT6: 42 mA
- STM32F103C8T6: 34 mA
Standby (VDD = 3.3 V)
- STM32F103CBU6: 14 µA
- GD32F103CBT6: 18 µA
- STM32F103C8T6: 12 µA
UFQFPN-48 θJA = 45 °C/W; LQFP-48 θJA = 38 °C/W (JESD51-7).
5. Ecosystem & Tool-chain
STM32 Advantages
- STM32CubeMX auto-generation
- HAL/LL libraries with MISRA-C
- ST-LINK, J-Link, DAP-Link support
- Certified IEC 60730 safety library
GD32 Considerations
- GD32CubeIDE (Eclipse-based)
- Requires modified CMSIS startup files
- GD-Link for trace; SWD only with J-Link
- Keeper bit defaults differ—review errata
6. Decision Matrix
| Priority | Recommended | Justification |
|---|---|---|
| 108 MHz throughput, fast erase | GD32F103CBT6 | 50 % faster core, 10× faster OTA |
| Medical / safety certification | STM32F103CBU6 | ST safety manual, IEC 60730 library |
| Drop-in C8T6 upgrade, more Flash | STM32F103CBT6 | Same LQFP, double Flash |
| Smallest PCB | STM32F103CBU6 | UFQFPN saves 0.5 mm height |
7. Procurement & Authenticity
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