EZ6301QI: Verified 1.5 A Triple

EZ6301QI: Power Dissipation & Thermal Performance in Real-World Use

Introduction

Designers selecting the Intel^® Enpirion^® EZ6301QI triple-output module often ask two questions:

How much power will it dissipate under realistic loading?
How hot will it run and what thermal measures are required?

This article answers both questions using only data extracted from Intel’s official datasheet (Rev G, July 2019) and standard thermal calculations.

Verified Electrical & Thermal Parameters

Parameter	Value (per datasheet)
Buck converter continuous current	1.5 A
LDO 1 & 2 continuous current	300 mA each
θ_JA (no airflow, JESD51-7 board)	11.5 °C/W
Maximum junction temperature (T_J,max)	125 °C
Thermal shutdown threshold	≈ 155 °C

Example: Maximum-Load Power Dissipation

Operating conditions

V_IN = 5 V (common USB-C rail)
Buck: 3.3 V @ 1.5 A
LDO1: 2.5 V @ 300 mA
LDO2: 1.8 V @ 300 mA

Step 1 – Power loss per rail

Rail	P_OUT	Efficiency or Drop	P_LOSS
Buck	3.3 V × 1.5 A = 4.95 W	η = 92 % @ 1.5 A	4.95 W / 0.92 – 4.95 ≈ 0.43 W
LDO1	2.5 V × 0.3 A = 0.75 W	Drop = 5 V – 2.5 V = 2.5 V	2.5 V × 0.3 A = 0.75 W
LDO2	1.8 V × 0.3 A = 0.54 W	Drop = 5 V – 1.8 V = 3.2 V	3.2 V × 0.3 A = 0.96 W

Total module dissipation
P_D,total = 0.43 W + 0.75 W + 0.96 W ≈ 2.14 W

Step 2 – Junction temperature rise

Temperature rise:
ΔT = P_D,total × θ_JA = 2.14 W × 11.5 °C/W ≈ 24.6 °C
Junction temperature at 25 °C ambient:
T_J = 25 °C + 24.6 °C ≈ 49.6 °C
Maximum allowable ambient (T_A,max) before hitting 125 °C:
T_A,max = 125 °C – 24.6 °C ≈ 100.4 °C

Practical Thermal Design Guidance

PCB heatsinking
- Solder the 4 mm × 7 mm exposed pad to a 1 oz ground plane with ≥ 25 mm² copper pour.
- Add a 5 × 5 array of 0.3 mm vias to inner ground layers for an extra 1–2 °C/W improvement.
Airflow impact
- 200 LFM airflow lowers θ_JA to ≈ 9 °C/W, extending T_A,max to ≈ 106 °C.
Thermal shutdown margin
- Even at 85 °C ambient, T_J ≈ 85 °C + 24.6 °C = 109.6 °C—still 15 °C below the 125 °C limit.

Note: The datasheet states efficiency curves are measured at room temperature; derate 1–2 % at 85 °C to maintain margin.

Summary

Power loss: Expect ≈ 2.1 W when all three rails are fully loaded to datasheet limits.
Cooling requirement: None below 85 °C ambient if the exposed pad is properly soldered to a continuous ground plane. For sealed enclosures or higher ambients, add 200 LFM airflow or enlarge copper area.

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