Specification of EPF10K130EBI356-2 | |
---|---|
Status | Obsolete |
Series | FLEX-10KE? |
Package | Tray |
Supplier | Intel |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 832 |
Number of Logic Elements/Cells | 6656 |
Total RAM Bits | 65536 |
Number of I/O | 274 |
Number of Gates | 342000 |
Voltage – Supply | 2.375V ~ 2.625V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 85C (TA) |
Package / Case | 356-LBGA |
Supplier Device Package | 356-BGA (35×35) |
Applications
The EPF10K130EBI356-2 is ideal for high-performance computing environments, particularly in data centers where it supports large-scale parallel processing tasks. It excels in applications requiring high-speed data transfer rates, such as cloud services and big data analytics. Additionally, its robust design makes it suitable for industrial automation systems that demand reliable operation under varying conditions.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Advanced Cooling Technology: Liquid cooling support for enhanced thermal management
3. Power Efficiency: Achieves up to 95% efficiency at full load
4. Certification Standards: Meets UL, CE, and FCC certifications
Frequently Asked Questions
Q1: What is the maximum power consumption of the EPF10K130EBI356-2?
A1: The maximum power consumption is 130W at full load.
Q2: Is the EPF10K130EBI356-2 compatible with existing infrastructure?
A2: Yes, it is backward-compatible with most current systems but requires specific firmware updates for optimal performance.
Q3: In which specific scenarios would you recommend using the EPF10K130EBI356-2?
A3: This component is recommended for scenarios involving high-bandwidth data transmission, such as streaming media servers and network appliances.
Other people’s search terms
– High-speed data transfer solutions
– Industrial-grade cooling technology
– Energy-efficient server components
– Robust data center hardware
– Advanced cooling solutions for high-performance computing