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EP3SL50F780I3 Stratix III FPGA

EP3SL50F780I3 Stratix III FPGA – Unified Technical Guide for Engineers

EP3SL50F780I3 Stratix III FPGA – Unified Technical Guide for Engineers

Part Number Decoding

FieldMeaning
EPIntel (Altera) FPGA family prefix
3SStratix III generation, 65 nm process
L50Logic-optimized variant, ≈47.5 k LE
F780780-pin FineLine BGA, 1.0 mm pitch
IIndustrial temperature –40 °C to 100 °C
3Fastest commercial speed grade (-3)

Core Specifications

ParameterValueRemarks
Logic Elements47 500 LE≈19 000 ALMs, 4-input LUTs
Embedded Memory2.08 MbitM9K blocks, ECC capable
DSP Blocks92 × 18×18Cascadable up to 36×36
PLLs8Fractional-N, dynamic phase shift
User I/O488 max24 banks, multi-standard
Core Voltage1.1 V ± 3 %2.5 V / 3.3 V I/O banks
Power Reduction≈50 % staticPer-block power gating

Architecture Highlights

  • ALUT Fabric: Each adaptive logic module (ALM) contains a 4-input LUT plus two adders, enabling 6-input functions or dual 4-input functions, improving utilization by ≈20 % over fixed LUT-4 designs.
  • DSP Column: Half-DSP blocks operate at 550 MHz in 18-bit, 36-bit, or 54-bit modes; cascade chains support FIR filters > 256 taps without fabric routing.
  • Clocking: Global, regional, and peripheral networks deliver up to 550 MHz fabric performance; dynamic phase stepping for source-synchronous links.
  • I/O Banks: Eight banks with independent VCCIO and on-chip termination (OCT) auto-calibration; DQS groups sustain DDR3-800.

PCB & Power Design Guidelines

  1. Package: 29 mm × 29 mm FineLine BGA, 1.0 mm pitch; 8-layer board with via-in-pad recommended to escape all 488 user balls.
  2. Decoupling: 0.1 µF X7R per power pin plus 10 µF bulk; target 10 mΩ impedance at 100 MHz.
  3. Sequencing: Core 1.1 V before 2.5 V aux; 50 ms soft-start to avoid brownout. Intel Enpirion 10 A modules are validated companions.
  4. Thermal: θJA ≈ 11 °C/W still air; 200 LFM airflow or 25 mm heatsink above 70 °C ambient.

Tool Flow & Verification

  • Quartus II 9.0+ / Prime Lite: Enable “Power-Driven Compilation” and “Physical Synthesis for Performance” to exceed 200 MHz on DSP-heavy designs.
  • SignalTap II: 2 kB sample depth @ 250 MHz suffices for most state-machine debug.
  • ModelSim-Altera 6.6b+: Pre-compiled Stratix III libraries cut setup time to < 2 min.
  • JTAG: BSDL file supports IEEE 1532 ISP and real-time firmware updates.
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Typical Applications

DomainUse-CaseFeature Leveraged
Machine Vision1080p60 edge detection92 DSP blocks + LVDS I/O
SDR Baseband2×2 MIMO DUC/DDC550 MHz MACs + deterministic PLL
Industrial Motion8-axis servo loop488 I/O + industrial temp
ATE Channel CardPattern generatorSSTL-15, OCT

Cross-Vendor Snapshot

VendorDeviceLogic (kLE)DSP (18×18)SerDes (Gbps)Node (nm)
IntelEP3SL50F780I347.59265
Intel10AX027H2F34I2SG279617.420
زیلینکسXC7K70T-2FBG676I6524012.528

Choose EP3SL50 when legacy 65 nm supply chains and proven industrial-grade reliability outweigh the need for high-speed transceivers.

Pitfalls & Mitigation

  • Timing Closure: Enable “Perform Register Duplication” for > 300 MHz.
  • Config Flash: Use EPCQ16A or larger; EPCS lacks bitstream compression.
  • Hot-Socket: Limit I/O to 3.6 V max during insertion.

Procurement

For immediate samples or bulk orders, you can contact the supplier via the contact email below..

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