Part Number Decoding
Field | Meaning |
---|---|
EP | Intel (Altera) FPGA family prefix |
3S | Stratix III generation, 65 nm process |
L50 | Logic-optimized variant, ≈47.5 k LE |
F780 | 780-pin FineLine BGA, 1.0 mm pitch |
I | Industrial temperature –40 °C to 100 °C |
3 | Fastest commercial speed grade (-3) |
Core Specifications
Parameter | Value | Remarks |
---|---|---|
Logic Elements | 47 500 LE | ≈19 000 ALMs, 4-input LUTs |
Embedded Memory | 2.08 Mbit | M9K blocks, ECC capable |
DSP Blocks | 92 × 18×18 | Cascadable up to 36×36 |
PLLs | 8 | Fractional-N, dynamic phase shift |
User I/O | 488 max | 24 banks, multi-standard |
Core Voltage | 1.1 V ± 3 % | 2.5 V / 3.3 V I/O banks |
Power Reduction | ≈50 % static | Per-block power gating |
Architecture Highlights
- ALUT Fabric: Each adaptive logic module (ALM) contains a 4-input LUT plus two adders, enabling 6-input functions or dual 4-input functions, improving utilization by ≈20 % over fixed LUT-4 designs.
- DSP Column: Half-DSP blocks operate at 550 MHz in 18-bit, 36-bit, or 54-bit modes; cascade chains support FIR filters > 256 taps without fabric routing.
- Clocking: Global, regional, and peripheral networks deliver up to 550 MHz fabric performance; dynamic phase stepping for source-synchronous links.
- I/O Banks: Eight banks with independent
VCCIO
and on-chip termination (OCT) auto-calibration; DQS groups sustain DDR3-800.
PCB & Power Design Guidelines
- Package: 29 mm × 29 mm FineLine BGA, 1.0 mm pitch; 8-layer board with via-in-pad recommended to escape all 488 user balls.
- Decoupling: 0.1 µF X7R per power pin plus 10 µF bulk; target 10 mΩ impedance at 100 MHz.
- Sequencing: Core 1.1 V before 2.5 V aux; 50 ms soft-start to avoid brownout. Intel Enpirion 10 A modules are validated companions.
- Thermal: θJA ≈ 11 °C/W still air; 200 LFM airflow or 25 mm heatsink above 70 °C ambient.
Tool Flow & Verification
- Quartus II 9.0+ / Prime Lite: Enable “Power-Driven Compilation” and “Physical Synthesis for Performance” to exceed 200 MHz on DSP-heavy designs.
- SignalTap II: 2 kB sample depth @ 250 MHz suffices for most state-machine debug.
- ModelSim-Altera 6.6b+: Pre-compiled Stratix III libraries cut setup time to < 2 min.
- JTAG: BSDL file supports IEEE 1532 ISP and real-time firmware updates.

Typical Applications
Domain | Use-Case | Feature Leveraged |
---|---|---|
Machine Vision | 1080p60 edge detection | 92 DSP blocks + LVDS I/O |
SDR Baseband | 2×2 MIMO DUC/DDC | 550 MHz MACs + deterministic PLL |
Industrial Motion | 8-axis servo loop | 488 I/O + industrial temp |
ATE Channel Card | Pattern generator | SSTL-15, OCT |
Cross-Vendor Snapshot
Vendor | Device | Logic (kLE) | DSP (18×18) | SerDes (Gbps) | Node (nm) |
---|---|---|---|---|---|
Intel | EP3SL50F780I3 | 47.5 | 92 | — | 65 |
Intel | 10AX027H2F34I2SG | 27 | 96 | 17.4 | 20 |
زیلینکس | XC7K70T-2FBG676I | 65 | 240 | 12.5 | 28 |
Choose EP3SL50 when legacy 65 nm supply chains and proven industrial-grade reliability outweigh the need for high-speed transceivers.
Pitfalls & Mitigation
- Timing Closure: Enable “Perform Register Duplication” for > 300 MHz.
- Config Flash: Use EPCQ16A or larger; EPCS lacks bitstream compression.
- Hot-Socket: Limit I/O to 3.6 V max during insertion.
Procurement
For immediate samples or bulk orders, you can contact the supplier via the contact email below..
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