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XCVU23P-1FSVJ1760I

Part Number XCVU23P-1FSVJ1760I
Manufacturer Xilinx
Description IC FPGA VIRTEX-UP 1760FCBGA
Price for XCVU23P-1FSVJ1760I
Specification of XCVU23P-1FSVJ1760I
Status Active
Series Virtex? UltraScale+?
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 128700
Number of Logic Elements/Cells 2252250
Total RAM Bits 77909197
Number of I/O 644
Number of Gates
Voltage – Supply 0.825V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature -40C ~ 100C (TJ)
Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1760-FCBGA (42.5×42.5)

Applications

The XCVU23P-1FSVJ1760I is ideal for high-performance computing environments such as data centers, where it can handle large-scale data processing tasks efficiently. It also excels in automotive applications, particularly in advanced driver assistance systems (ADAS), where its robustness under various environmental conditions is crucial. Additionally, it finds application in telecommunications infrastructure, supporting complex network protocols and ensuring reliable communication services.

Key Advantages

1. High clock speed up to 800 MHz, enabling faster processing capabilities.

2. Advanced multi-core architecture that enhances parallel processing performance.

3. Low power consumption per gigaflop, making it energy-efficient.

4. Compliant with multiple industry-standard certifications, ensuring reliability and safety.

Frequently Asked Questions

Q1: Can the XCVU23P-1FSVJ1760I operate effectively at extreme temperatures?

A1: Yes, it operates within a wide range of temperatures from -40¡ãC to +85¡ãC, making it suitable for both indoor and outdoor applications.

Q2: Is the XCVU23P-1FSVJ1760I compatible with existing hardware?

A2: The chip is backward-compatible with previous models, but for optimal performance, it is recommended to integrate it into new designs optimized for its features.

Q3: In which specific scenarios would you recommend using the XCVU23P-1FSVJ1760I?

A3: This chip is recommended for scenarios requiring high computational power and low latency, such as real-time data analysis in financial markets, high-speed networking equipment, and AI-driven autonomous vehicles.

Other people’s search terms

– High-performance computing solutions

– Automotive electronics components

– Telecommunications network processors

– Multi-core processor technology

– Energy-efficient computing devices

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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