Specification of XC6VCX195T-2FFG784C | |
---|---|
Status | Active |
Series | Virtex?-6 CXT |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 15600 |
Number of Logic Elements/Cells | 199680 |
Total RAM Bits | 12681216 |
Number of I/O | 400 |
Number of Gates | – |
Voltage – Supply | 0.95V ~ 1.05V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 784-BBGA, FCBGA |
Supplier Device Package | 784-FCBGA (29×29) |
Applications
The XC6VCX195T-2FFG784C is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in applications such as artificial intelligence training, big data analytics, and cloud computing services. This device operates within a wide range of temperatures from -40¡ãC to +85¡ãC, ensuring reliability across various environmental conditions.
Key Advantages
1. High clock speed up to 500 MHz, providing superior computational performance.
2. Advanced parallel processing architecture that enhances data throughput.
3. Low power consumption, reducing operational costs significantly.
4. Compliant with multiple industry-standard certifications, ensuring robust security and compliance.
Frequently Asked Questions
Q1: What is the maximum operating temperature for the XC6VCX195T-2FFG784C?
A1: The maximum operating temperature for the XC6VCX195T-2FFG784C is +85¡ãC.
Q2: Can the XC6VCX195T-2FFG784C be used in conjunction with other components?
A2: Yes, it can be integrated with various other components through standard interfaces like PCIe and DDR4, enhancing system flexibility and scalability.
Q3: In which specific scenarios would you recommend using the XC6VCX195T-2FFG784C?
A3: The XC6VCX195T-2FFG784C is recommended for scenarios requiring high-speed data processing and analysis, such as real-time video streaming, financial market analysis, and scientific simulations.
Other people’s search terms
– High-performance computing solutions
– AI training accelerators
– Cloud computing hardware
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– Temperature-resistant computing devices