| Specification of XC6SLX75-3FGG676C | |
|---|---|
| وضعیت | فعال |
| سری | Spartan?-6 LX |
| بسته‌بندی | سینی |
| تامین کننده | AMD |
| قابل برنامه‌ریزی Digi-Key | تأیید نشده |
| تعداد LAB/CLB ها | 5831 |
| تعداد عناصر/سلول‌های منطقی | 74637 |
| کل بیت‌های RAM | 3170304 |
| تعداد ورودی/خروجی | 408 |
| تعداد گیت‌ها | – |
| ولتاژ تغذیه | 1.14V ~ 1.26V |
| نوع نصب | نصب سطحی |
| دمای عملیاتی | 0C ~ 85C (TJ) |
| بسته‌بندی / محفظه | 676-BGA |
| بسته‌بندی دستگاه تامین کننده | 676-FBGA (27×27) |
کاربردها
The XC6SLX75-3FGG676C is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in applications such as artificial intelligence training, big data analytics, and cloud computing services. This device operates within a wide range of temperatures from -40¡ãC to +85¡ãC, ensuring reliability across various environmental conditions.
مزایای کلیدی
1. High clock speed up to 300 MHz, providing superior computational performance.
2. Advanced memory interface supporting DDR4 at speeds up to 2666 MT/s, enhancing data throughput.
3. Energy-efficient design with power consumption optimized for extended operation without overheating.
4. Meets stringent industrial certification standards including CE, FCC, and RoHS compliance.
سؤالات متداول
Q1: Can the XC6SLX75-3FGG676C be used in high-temperature environments?
A1: Yes, it can operate effectively between -40¡ãC and +85¡ãC, making it suitable for both indoor and outdoor applications requiring robust performance.
Q2: What are the specific memory interfaces supported by the XC6SLX75-3FGG676C?
A2: The XC6SLX75-3FGG676C supports DDR4 memory interfaces with speeds up to 2666 MT/s, which is beneficial for applications needing fast data access rates.
Q3: In which industries is the XC6SLX75-3FGG676C commonly utilized?
A3: Commonly used in sectors like telecommunications, automotive electronics, and aerospace, where high-speed processing and reliability are paramount.
عبارات جستجوی افراد دیگر
– راه حل‌های محاسباتی با کارایی بالا
– Artificial intelligence hardware components
– Cloud computing infrastructure requirements
– Industrial-grade memory interface technology
– Energy-efficient processor specifications
