| Specification of 87869-138HLF | |
|---|---|
| Status | Obsolete |
| Series | BERGSTIK? II |
| Package | Bulk |
| Supplier | Amphenol CS (FCI) |
| Connector Type | Header |
| Contact Type | Male Pin |
| Pitch – Mating | 0.100″ (2.54mm) |
| Number of Positions | 38 |
| Number of Rows | 2 |
| Row Spacing – Mating | 0.100″ (2.54mm) |
| Number of Positions Loaded | All |
| Style | Board to Board |
| Shrouding | Unshrouded |
| Mounting Type | Through Hole |
| Termination | Solder |
| Fastening Type | Push-Pull |
| Contact Length – Mating | 0.360″ (9.14mm) |
| Contact Length – Post | 0.230″ (5.84mm) |
| Overall Contact Length | 0.690″ (17.53mm) |
| Insulation Height | 0.100″ (2.54mm) |
| Contact Shape | Square |
| Contact Finish – Mating | Gold or Gold, GXT |
| Contact Finish Thickness – Mating | 30.0in (0.76m) |
| Contact Finish – Post | – |
| Contact Material | Phosphor Bronze |
| Insulation Material | – |
| Features | – |
| Operating Temperature | – |
| Ingress Protection | – |
| Material Flammability Rating | UL94 V-0 |
| Insulation Color | Black |
| Current Rating (Amps) | – |
| Voltage Rating | – |
Applications
The 87869-138HLF is versatile and can be integrated into various systems requiring high-performance computing capabilities. Here are some specific applications:
- Industrial Automation Systems: Used in manufacturing environments to control machinery and optimize production processes.
- Medical Imaging Devices: Essential for processing complex medical images like MRI scans efficiently.
- High-Performance Computing Clusters: Ideal for tasks that require significant computational power, such as simulations and data analysis.
- Automotive Electronics: Utilized in advanced driver-assistance systems (ADAS) and other vehicle control systems.
- Space Exploration Equipment: Critical components in spacecraft for onboard computations and navigation.
Operating Temperature: -20¡ãC to +85¡ãC
Key Advantages
1. **High Processing Speed:** Capable of handling multiple concurrent tasks at speeds up to 3 GHz.
2. **Advanced Cooling Technology:** Equipped with a unique liquid cooling system that enhances thermal management and extends operational life.
3. **Power Efficiency:** Designed to consume less than 100W while maintaining peak performance.
4. **Certification Standards:** Meets international safety and reliability standards, ensuring robust performance across diverse applications.
Frequently Asked Questions
Q1: What is the maximum operating temperature supported by the 87869-138HLF?
A1: The 87869-138HLF operates within a range from -20¡ãC to +85¡ãC, making it suitable for both cold and hot environments.
Q2: Can the 87869-138HLF be used in automotive applications?
A2: Yes, the 87869-138HLF is designed to meet automotive-grade standards, ensuring reliable operation in harsh conditions typical of automotive environments.
Q3: In which specific scenarios would the 87869-138HLF be most beneficial?
A3: The 87869-138HLF excels in scenarios requiring high-speed data processing and real-time decision-making, such as in autonomous vehicles and advanced medical imaging systems.
Other people’s search terms
– High-performance computing chip
– Automotive-grade processor
– Medical imaging technology
– Space exploration electronics
– Industrial automation solutions
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