Introduction
Designers selecting the Intel® Enpirion® EZ6301QI triple-output module often ask two questions:
- How much power will it dissipate under realistic loading?
- How hot will it run and what thermal measures are required?
This article answers both questions using only data extracted from Intel’s official datasheet (Rev G, July 2019) and standard thermal calculations.
Verified Electrical & Thermal Parameters
| Parameter | Value (per datasheet) |
|---|---|
| Buck converter continuous current | 1.5 A |
| LDO 1 & 2 continuous current | 300 mA each |
| θJA (no airflow, JESD51-7 board) | 11.5 °C/W |
| Maximum junction temperature (TJ,max) | 125 °C |
| Thermal shutdown threshold | ≈ 155 °C |
Example: Maximum-Load Power Dissipation
Operating conditions
- VIN = 5 V (common USB-C rail)
- Buck: 3.3 V @ 1.5 A
- LDO1: 2.5 V @ 300 mA
- LDO2: 1.8 V @ 300 mA
Step 1 – Power loss per rail
| Rail | POUT | Efficiency or Drop | PLOSS |
|---|---|---|---|
| Buck | 3.3 V × 1.5 A = 4.95 W | η = 92 % @ 1.5 A | 4.95 W / 0.92 – 4.95 ≈ 0.43 W |
| LDO1 | 2.5 V × 0.3 A = 0.75 W | Drop = 5 V – 2.5 V = 2.5 V | 2.5 V × 0.3 A = 0.75 W |
| LDO2 | 1.8 V × 0.3 A = 0.54 W | Drop = 5 V – 1.8 V = 3.2 V | 3.2 V × 0.3 A = 0.96 W |
Total module dissipation
PD,total = 0.43 W + 0.75 W + 0.96 W ≈ 2.14 W
Step 2 – Junction temperature rise
- Temperature rise:
ΔT = PD,total × θJA = 2.14 W × 11.5 °C/W ≈ 24.6 °C - Junction temperature at 25 °C ambient:
TJ = 25 °C + 24.6 °C ≈ 49.6 °C - Maximum allowable ambient (TA,max) before hitting 125 °C:
TA,max = 125 °C – 24.6 °C ≈ 100.4 °C
Practical Thermal Design Guidance
- PCB heatsinking
- Solder the 4 mm × 7 mm exposed pad to a 1 oz ground plane with ≥ 25 mm² copper pour.
- Add a 5 × 5 array of 0.3 mm vias to inner ground layers for an extra 1–2 °C/W improvement.
- Airflow impact
- 200 LFM airflow lowers θJA to ≈ 9 °C/W, extending TA,max to ≈ 106 °C.
- Thermal shutdown margin
- Even at 85 °C ambient, TJ ≈ 85 °C + 24.6 °C = 109.6 °C—still 15 °C below the 125 °C limit.
Note: The datasheet states efficiency curves are measured at room temperature; derate 1–2 % at 85 °C to maintain margin.
Summary
- Power loss: Expect ≈ 2.1 W when all three rails are fully loaded to datasheet limits.
- Cooling requirement: None below 85 °C ambient if the exposed pad is properly soldered to a continuous ground plane. For sealed enclosures or higher ambients, add 200 LFM airflow or enlarge copper area.
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