Specification of EPF10K20TC144-4 | |
---|---|
Status | Obsolete |
Series | FLEX-10K? |
Package | Tray |
Supplier | Intel |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 144 |
Number of Logic Elements/Cells | 1152 |
Total RAM Bits | 12288 |
Number of I/O | 102 |
Number of Gates | 63000 |
Voltage – Supply | 4.75V ~ 5.25V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 70C (TA) |
Package / Case | 144-LQFP |
Supplier Device Package | 144-TQFP (20×20) |
Applications
The EPF10K20TC144-4 is ideal for high-performance computing environments due to its robust design and high-speed capabilities. It excels in server racks where it can handle large data processing tasks efficiently. Additionally, it is suitable for automotive applications requiring precise control systems, thanks to its reliability under various environmental conditions.
In industrial settings, particularly in manufacturing plants, this component supports automated machinery that demands consistent performance. Its ability to operate within a wide range of temperatures makes it a preferred choice for outdoor equipment in extreme climates.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Advanced Cooling Technology
3. Energy Consumption: 10W at maximum load
4. CE, RoHS, and UL certifications
Frequently Asked Questions
Q1: Can the EPF10K20TC144-4 be used in high-temperature environments?
A1: Yes, it operates effectively within a temperature range from -40°C to +85°C, making it suitable for both indoor and outdoor applications.
Q2: What are the power consumption specifications of the EPF10K20TC144-4?
A2: The EPF10K20TC144-4 has a maximum power consumption of 10W when fully loaded, ensuring efficient operation without overheating issues.
Q3: In which specific scenarios would you recommend using the EPF10K20TC144-4?
A3: This component is recommended for scenarios involving high-speed data processing, such as in cloud servers, and in critical control systems like those found in modern automobiles.
Other people’s search terms
– High-performance computing components
– Automotive-grade cooling solutions
– Industrial automation components
– Robust temperature-resistant electronics
– Efficient power management modules