Specification of EPF10K130EFI484-2 | |
---|---|
Status | Obsolete |
Series | FLEX-10KE? |
Package | Tray |
Supplier | Intel |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 832 |
Number of Logic Elements/Cells | 6656 |
Total RAM Bits | 65536 |
Number of I/O | 369 |
Number of Gates | 342000 |
Voltage – Supply | 2.375V ~ 2.625V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 85C (TA) |
Package / Case | 484-BBGA |
Supplier Device Package | 484-FBGA (23×23) |
Applications
The EPF10K130EFI484-2 is designed for high-performance computing environments, particularly in data centers and cloud computing services. It supports large-scale parallel processing tasks efficiently. This component is also suitable for industrial automation systems that require robust control and monitoring capabilities.
Operating Temperature: -40°C to +85°C
Key Advantages
1. High clock speed up to 130 MHz
2. Advanced memory interface supporting DDR4 at speeds up to 2667 MHz
3. Energy-efficient design with low power consumption per core
4. Compliance with industry-standard certifications such as CE, FCC, and RoHS
Frequently Asked Questions
Q1: What is the maximum supported memory bandwidth?
A1: The EPF10K130EFI484-2 can support a maximum memory bandwidth of 21.3 GB/s when using DDR4 memory at its highest frequency.
Q2: Is this component compatible with legacy systems?
A2: Yes, it maintains backward compatibility with older systems while offering enhanced performance features.
Q3: In which specific scenarios would you recommend using this EPF10K130EFI484-2?
A3: This component is ideal for scenarios requiring high computational throughput, such as deep learning training, big data analytics, and real-time simulation applications.
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