Specification of EP4SGX110HF35C3 | |
---|---|
Status | Obsolete |
Series | Stratix? IV GX |
Package | Tray |
Supplier | Intel |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 4224 |
Number of Logic Elements/Cells | 105600 |
Total RAM Bits | 9793536 |
Number of I/O | 488 |
Number of Gates | – |
Voltage – Supply | 0.87V ~ 0.93V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 1152-BBGA, FCBGA |
Supplier Device Package | 1152-FBGA (35×35) |
Applications
The EP4SGX110HF35C3 is designed for high-performance computing environments, particularly in data centers and cloud computing services. It supports large-scale data processing tasks such as machine learning algorithms, big data analytics, and scientific simulations. This chip operates efficiently within a wide range of temperatures from -40°C to +85°C, ensuring reliability across various environmental conditions.
Key Advantages
1. High clock speed up to 3.5 GHz, providing superior computational performance.
2. Advanced memory interface supporting DDR5 RAM for faster data transfer rates.
3. Energy-efficient design with a power consumption of less than 100W at maximum load.
4. Compliant with industry-standard certifications like ISO 9001 and RoHS.
Frequently Asked Questions
Q1: What is the maximum operating temperature of the EP4SGX110HF35C3?
A1: The maximum operating temperature of the EP4SGX110HF35C3 is +85°C.
Q2: Can the EP4SGX110HF35C3 be used in conjunction with other chips?
A2: Yes, it can be integrated with other components through its advanced interconnect features, enhancing overall system performance.
Q3: In which specific scenarios would you recommend using the EP4SGX110HF35C3?
A3: The EP4SGX110HF35C3 is ideal for scenarios requiring high-speed data processing and low-latency operations, such as real-time data analysis in financial markets and autonomous vehicle systems.
Other people’s search terms
– High-performance computing solutions
– Data center optimization technology
– Cloud computing hardware enhancements
– Advanced memory interface capabilities
– Energy-efficient chip design