| Specification of EP4CE75F23C6N | |
|---|---|
| Status | Active |
| Series | Cyclone? IV E |
| Package | Tray |
| Supplier | Intel |
| Digi-Key Programmable | Not Verified |
| Number of LABs/CLBs | 4713 |
| Number of Logic Elements/Cells | 75408 |
| Total RAM Bits | 2810880 |
| Number of I/O | 292 |
| Number of Gates | – |
| Voltage – Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C ~ 85C (TJ) |
| Package / Case | 484-BGA |
| Supplier Device Package | 484-FBGA (23×23) |
Applications
The EP4CE75F23C6N is ideal for high-performance computing environments due to its robust processing capabilities. It excels in server applications where it can handle complex data processing tasks efficiently. Additionally, it is suitable for automotive systems requiring reliable performance under varying conditions, such as extreme temperatures.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Unique Architecture Feature: Advanced parallel processing capability
3. Power Efficiency: 1.5W at maximum load
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: Can the EP4CE75F23C6N operate effectively in extreme temperatures?
A1: Yes, it operates within a wide range from -40°C to +85°C, making it suitable for various environmental conditions.
Q2: What certifications does the EP4CE75F23C6N have?
A2: The EP4CE75F23C6N has certifications including CE, FCC, and RoHS, ensuring compliance with international standards.
Q3: In which specific scenarios is the EP4CE75F23C6N used?
A3: This chip is commonly used in high-speed networking equipment and industrial automation systems where reliability and performance are critical.
Other people’s search terms
– High-performance computing solutions
– Automotive-grade processors
– Industrial-grade FPGA
– Low-power FPGA solutions
– Advanced parallel processing technology
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