Specification of EP4CE6F17C8LN | |
---|---|
Status | Active |
Series | Cyclone? IV E |
Package | Tray |
Supplier | Intel |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 392 |
Number of Logic Elements/Cells | 6272 |
Total RAM Bits | 276480 |
Number of I/O | 179 |
Number of Gates | – |
Voltage – Supply | 0.97V ~ 1.03V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 256-LBGA |
Supplier Device Package | 256-FBGA (17×17) |
Applications
The EP4CE6F17C8LN is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as cloud computing services, where it can handle large-scale data processing tasks efficiently. Additionally, it is suitable for automotive electronics systems, supporting advanced driver assistance systems that require fast response times and high reliability.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Unique Architecture Feature: Advanced parallel processing architecture
3. Power Efficiency: 1.5W at 25°C
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: Can the EP4CE6F17C8LN be used in extreme temperatures?
A1: Yes, it operates within a wide range from -40°C to +85°C, making it suitable for various environmental conditions.
Q2: Is there any specific software requirement for this chip?
A2: The EP4CE6F17C8LN supports standard software development tools like Vivado and ISE, which are compatible with Xilinx FPGA devices.
Q3: In which specific scenarios would you recommend using this EP4CE6F17C8LN?
A3: This chip is recommended for scenarios requiring high-speed data processing and low-power consumption, such as in embedded systems for IoT devices and in server farms for data centers.
Other people’s search terms
– High-performance FPGA solutions
– Automotive electronics FPGA
– Cloud computing FPGA
– Low-power FPGA design
– Industrial-grade FPGA