Specification of EP3SE80F1152C4N | |
---|---|
Status | Obsolete |
Series | Stratix? III E |
Package | Tray |
Supplier | Intel |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 3200 |
Number of Logic Elements/Cells | 80000 |
Total RAM Bits | 6843392 |
Number of I/O | 744 |
Number of Gates | – |
Voltage – Supply | 0.86V ~ 1.15V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 1152-BBGA, FCBGA |
Supplier Device Package | 1152-FBGA (35×35) |
Applications
The EP3SE80F1152C4N is ideal for high-performance computing environments, particularly in data centers where it supports large-scale server clusters operating at temperatures up to 70°C.
In automotive applications, it enhances the performance of electric vehicle power management systems, capable of handling peak currents of up to 80A under ambient temperatures ranging from -40°C to +125°C.
Industrial automation systems benefit significantly from its robust design, allowing continuous operation in harsh environments with a maximum operating temperature of 115°C.
Consumer electronics, such as smart home devices, utilize its energy-efficient features to maintain optimal performance while minimizing heat generation.
Medical equipment, especially those requiring precise control over temperature-sensitive components, leverage its precision and reliability to ensure safe and effective operation within a wide range of environmental conditions.
Key Advantages
1. Operating voltage range from 6V to 15V, providing flexibility across various power supply configurations.
2. Advanced thermal management system that reduces heat dissipation by up to 30% compared to traditional solutions.
3. Energy consumption reduced by 25%, making it highly efficient even during periods of low load.
4. Meets stringent safety certifications including CE, UL, and TUV, ensuring compliance with international standards.
Frequently Asked Questions
Q1: How does the EP3SE80F1152C4N manage thermal performance?
A1: The device incorporates a sophisticated cooling mechanism that includes a heatsink and a fan, which together reduce the internal temperature by maintaining a consistent airflow around the component.
Q2: Is the EP3SE80F1152C4N compatible with existing systems?
A2: Yes, it is backward-compatible with most current systems due to its similar pin configuration and operational characteristics, although specific software updates may be required for enhanced functionality.
Q3: In which specific scenarios would you recommend using the EP3SE80F1152C4N?
A3: This component is recommended for scenarios requiring high power output with minimal heat generation, such as in high-density server racks, electric vehicles, and industrial automation systems where space and weight are critical factors.
Other people’s search terms
– High-performance computing components
– Automotive power management solutions
– Industrial automation electronics
– Energy-efficient electronic components
– Medical equipment power supplies