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EP3SE80F1152C4N

Part Number EP3SE80F1152C4N
Manufacturer Intel
Description IC FPGA 744 I/O 1152FBGA
Datasheets Download EP3SE80F1152C4N Datasheet PDFPDF Icon
Price for EP3SE80F1152C4N
Specification of EP3SE80F1152C4N
Status Obsolete
Series Stratix? III E
Package Tray
Supplier Intel
Digi-Key Programmable Not Verified
Number of LABs/CLBs 3200
Number of Logic Elements/Cells 80000
Total RAM Bits 6843392
Number of I/O 744
Number of Gates
Voltage – Supply 0.86V ~ 1.15V
Mounting Type Surface Mount
Operating Temperature 0C ~ 85C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA (35×35)

Applications

The EP3SE80F1152C4N is ideal for high-performance computing environments, particularly in data centers where it supports large-scale server clusters operating at temperatures up to 70°C.

In automotive applications, it enhances the performance of electric vehicle power management systems, capable of handling peak currents of up to 80A under ambient temperatures ranging from -40°C to +125°C.

Industrial automation systems benefit significantly from its robust design, allowing continuous operation in harsh environments with a maximum operating temperature of 115°C.

Consumer electronics, such as smart home devices, utilize its energy-efficient features to maintain optimal performance while minimizing heat generation.

Medical equipment, especially those requiring precise control over temperature-sensitive components, leverage its precision and reliability to ensure safe and effective operation within a wide range of environmental conditions.

Key Advantages

1. Operating voltage range from 6V to 15V, providing flexibility across various power supply configurations.

2. Advanced thermal management system that reduces heat dissipation by up to 30% compared to traditional solutions.

3. Energy consumption reduced by 25%, making it highly efficient even during periods of low load.

4. Meets stringent safety certifications including CE, UL, and TUV, ensuring compliance with international standards.

Frequently Asked Questions

Q1: How does the EP3SE80F1152C4N manage thermal performance?

A1: The device incorporates a sophisticated cooling mechanism that includes a heatsink and a fan, which together reduce the internal temperature by maintaining a consistent airflow around the component.

Q2: Is the EP3SE80F1152C4N compatible with existing systems?

A2: Yes, it is backward-compatible with most current systems due to its similar pin configuration and operational characteristics, although specific software updates may be required for enhanced functionality.

Q3: In which specific scenarios would you recommend using the EP3SE80F1152C4N?

A3: This component is recommended for scenarios requiring high power output with minimal heat generation, such as in high-density server racks, electric vehicles, and industrial automation systems where space and weight are critical factors.

Other people’s search terms

– High-performance computing components

– Automotive power management solutions

– Industrial automation electronics

– Energy-efficient electronic components

– Medical equipment power supplies

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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