| Specification of EP3C80F780I7 | |
|---|---|
| Status | Active |
| Series | Cyclone? III |
| Package | Tray |
| Supplier | Intel |
| Digi-Key Programmable | Not Verified |
| Number of LABs/CLBs | 5079 |
| Number of Logic Elements/Cells | 81264 |
| Total RAM Bits | 2810880 |
| Number of I/O | 429 |
| Number of Gates | – |
| Voltage – Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C ~ 100C (TJ) |
| Package / Case | 780-BGA |
| Supplier Device Package | 780-FBGA (29×29) |
Applications
The EP3C80F780I7 is ideal for high-speed digital signal processing tasks in telecommunications equipment, where it can handle complex algorithms efficiently within its specified operating temperature range of -40°C to +85°C.
In automotive electronics, it supports advanced driver assistance systems (ADAS) by providing robust performance under varying environmental conditions.
Industrial automation applications benefit from its ability to manage multiple I/O interfaces simultaneously, enhancing system reliability and efficiency.
Medical devices utilize its precision timing capabilities for critical life-support functions.
Consumer electronics leverage its low-power consumption features for battery-operated devices like smartwatches and portable media players.
Key Advantages
1. Operating speed up to 66 MHz, enabling fast data processing.
2. Advanced embedded memory blocks for efficient storage management.
3. Low power consumption, reducing energy costs and extending device lifespan.
4. Compliance with various industry certifications such as CE, RoHS, and UL.
Frequently Asked Questions
Q1: Can the EP3C80F780I7 be used in environments with extreme temperatures?
A1: Yes, it operates effectively within a wide temperature range of -40°C to +85°C, making it suitable for both cold and hot climates.
Q2: Is there a specific version of the EP3C80F780I7 that supports wireless communication protocols?
A2: The standard version does not support wireless communication directly; however, it can interface with external wireless modules through its I/O pins.
Q3: How does the EP3C80F780I7 perform in high-density packaging applications?
A3: It performs well in high-density packaging due to its compact size and efficient heat dissipation design, which helps maintain optimal operating temperatures even in tight spaces.
Other people’s search terms
– High-speed digital signal processing solutions
– Automotive electronics components
– Industrial automation processors
– Medical device microcontrollers
– Consumer electronics power-efficient chips
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