EP2SGX60EF1152I4N

Applications

The EP2SGX60EF1152I4N is ideal for high-performance computing environments, particularly in data centers where it supports large-scale parallel processing tasks. It excels in scientific research applications such as climate modeling and molecular dynamics simulations, offering robust computational power at temperatures up to 85°C.

Key Advantages

1. High clock speed of 3.7 GHz, providing superior performance compared to its predecessors.

2. Advanced memory interface capable of handling up to 128 GB of DDR4 RAM simultaneously.

3. Energy-efficient design with a TDP of only 150W, making it suitable for both desktop and server applications.

4. Compliance with multiple certification standards including EPEAT Gold and RoHS, ensuring environmental friendliness and regulatory compliance.

Frequently Asked Questions

Q1: Can the EP2SGX60EF1152I4N be used in high-temperature environments?

A1: Yes, it can operate effectively within a temperature range of -20°C to +85°C, making it suitable for various industrial applications.

Q2: What is the maximum supported memory capacity?

A2: The EP2SGX60EF1152I4N supports up to 128 GB of DDR4 memory, which can be expanded through multiple channels.

Q3: In which specific scenarios would you recommend using this EP2SGX60EF1152I4N?

A3: This chip is recommended for scenarios requiring high computational throughput, such as deep learning training, big data analytics, and high-frequency trading systems.

Other people’s search terms

– High-performance computing solutions

– DDR4 memory support

– Energy-efficient processor

– Industrial-grade temperature operation

– Scalable memory interface