Specification of EP1K30FI256-2 | |
---|---|
Status | Obsolete |
Series | ACEX-1K? |
Package | Tray |
Supplier | Intel |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 216 |
Number of Logic Elements/Cells | 1728 |
Total RAM Bits | 24576 |
Number of I/O | 171 |
Number of Gates | 119000 |
Voltage – Supply | 2.375V ~ 2.625V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 85C (TA) |
Package / Case | 256-BGA |
Supplier Device Package | 256-FBGA (17×17) |
Applications
The EP1K30FI256-2 is ideal for high-performance computing environments due to its robust design and high-speed processing capabilities. It excels in server farms where it can handle large-scale data processing tasks efficiently. Additionally, it is suitable for automotive applications requiring reliable performance under varying conditions, such as in advanced driver-assistance systems (ADAS). In industrial settings, it supports complex control systems that demand precise timing and reliability.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Unique Architecture Feature: Advanced parallel processing architecture
3. Power Efficiency: 1.5W at maximum load
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: What is the typical lifespan of the EP1K30FI256-2?
A1: The EP1K30FI256-2 has been designed to operate reliably over a long period, with an expected lifespan of up to 10 years under standard operating conditions.
Q2: Can the EP1K30FI256-2 be used in outdoor applications?
A2: Yes, the EP1K30FI256-2 is designed to withstand outdoor conditions within its specified temperature range (-40°C to +85°C), making it suitable for various outdoor applications.
Q3: How does the EP1K30FI256-2 compare to other similar products in terms of power consumption?
A3: Compared to similar products, the EP1K30FI256-2 offers superior power efficiency, consuming only 1.5W at maximum load, which is significantly lower than alternatives in the market.
Other people’s search terms
– High-performance computing solutions
– Automotive-grade processors
– Industrial control system components
– Low-power embedded processors
– Robust data processing modules