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XC7A35T FPGA: Technical Deep Dive for Embedded Systems Design

The Xilinx XC7A35T FPGA is the most cost-effective product in the Artix-7 family, using a compact BGA package, providing 33,280 logic cells and 90 DSP slices

XC7A35T FPGA: Technical Deep Dive for Embedded Systems Design

Product Overview and Market Positioning

The Xilinx XC7A35T FPGA represents the cost-performance sweet spot in the Artix-7 family, delivering 33,280 logic cells and 90 DSP slices in compact BGA packages. Built on 28nm HPL process technology, it achieves 50% lower static power than previous generations while supporting 6.6Gb/s transceivers (CSG324 variant).

Feature Artix-7 (XC7A35T) Spartan-7 Kintex-7
Logic Cells 33,280 25K-50K 100K-400K
Power Efficiency 28nm HPL 28nm HP 28nm HP/HPL
Transceivers Up to 6.6Gbps (4 lanes) None Up to 12.5Gbps

Technical Specifications

Parameter XC7A35T-1CSG324 XC7A35T-2FGG484 Unit
Logic Cells 33,280 33,280 LC
LUTs 20,800 20,800 4×6-LUT per slice
Block RAM 1,800 1,800 Kbits
DSP Slices 90 90 25×18-bit MAC
Max I/O 210 250 3.3V tolerant
Transceivers 4×6.6Gb/s GTP None CSG324 only
Power Consumption 1.5W @ 550MHz 1.5W @ 550MHz Active power
XC7A35T FPGA

Implementation Scenarios

Industrial Automation

Real-time motor control with <1μs latency using 90 DSP slices for field-oriented control algorithms. The integrated XADC enables precise sensor interfacing for closed-loop systems.

Medical Imaging

64-channel portable ultrasound processing with 30fps 2-D imaging via 930 GMACS DSP throughput. The 1.8Mb block RAM supports real-time beamforming calculations.

Communication Systems

Protocol conversion (PCIe↔Gigabit Ethernet) achieving 5Gbps throughput. GTP transceivers enable JESD204B and SFP+ fiber optic interfaces.

Development Ecosystem

  • Vivado Design Suite 2023.2: Supports constraint-driven implementation with Tcl scripting and MicroBlaze soft-core development
  • IP Cores: Includes DDR3 controller (800MHz), 10G Ethernet MAC, and AXI4 interconnect
  • Verification: Integrated Logic Analyzer (ILA) with 1,024-sample depth for real-time debugging
  • Reference Boards: Digilent Nexys 4 DDR (CSG324), Basys 3 (FTG256), Alinx AX7035B (FGG484)

Packaging Guidance

Package Dimensions I/O Count Thermal Resistance
CSG324 15×15mm 210 3.2°C/W
FTG256 13×13mm 170 4.1°C/W
FGG484 23×23mm 250 2.8°C/W

Procurement Considerations

For immediate samples or bulk orders, please contact authorized distributors via the following emails.

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