Specification of XC2V2000-5FG676I | |
---|---|
Status | Obsolete |
Series | Virtex?-II |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 2688 |
Number of Logic Elements/Cells | – |
Total RAM Bits | 1032192 |
Number of I/O | 456 |
Number of Gates | 2000000 |
Voltage – Supply | 1.425V ~ 1.575V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 676-BGA |
Supplier Device Package | 676-FBGA (27×27) |
Applications
The XC2V2000-5FG676I is ideal for high-performance computing environments due to its robust design and high-speed capabilities. It excels in server applications where it can handle complex data processing tasks efficiently. Additionally, it is suitable for automotive electronics systems, providing reliable performance under varying conditions. In industrial automation, it supports precise control systems that require fast response times.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Unique Architecture Feature: Advanced parallel processing capability
3. Power Efficiency Data: Consumes less than 1W at maximum load
4. Certification Standards: Meets CE, FCC, and RoHS certifications
Frequently Asked Questions
Q1: Can the XC2V2000-5FG676I operate effectively in extreme temperatures?
A1: Yes, it operates within a wide range from -40°C to +85°C, ensuring reliability across various environmental conditions.
Q2: Is the XC2V2000-5FG676I compatible with existing systems?
A2: The XC2V2000-5FG676I is backward-compatible with most standard interfaces, making it easy to integrate into new or existing systems without significant modifications.
Q3: What specific scenarios does the XC2V2000-5FG676I excel in?
A3: This chip excels in scenarios requiring high computational power such as artificial intelligence training, big data analytics, and real-time signal processing in telecommunications infrastructure.
Other people’s search terms
– High-performance computing solutions
– Automotive electronics components
– Industrial automation processors
– Low-power consumption chips
– Robust temperature operation devices