Specification of XC7Z045-1FFG676C | |
---|---|
Status | Active |
Series | Zynq?-7000 |
Package | Tray |
Supplier | AMD |
Architecture | MCU, FPGA |
Core Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
Flash Size | – |
RAM Size | 256KB |
Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 667MHz |
Primary Attributes | Kintex-7 FPGA, 350K Logic Cells |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 676-BBGA, FCBGA |
Supplier Device Package | 676-FCBGA (27×27) |
Applications
The XC7Z045-1FFG676C is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in applications such as artificial intelligence training, big data analytics, and cloud computing services. This device operates within a wide range of temperatures from -40°C to +85°C, ensuring reliability across various environmental conditions.
Key Advantages
1. High clock speed up to 500 MHz, providing superior computational performance.
2. Advanced memory interface supporting DDR4 RAM for faster data transfer rates.
3. Energy-efficient design with low power consumption, reducing operational costs.
4. Compliance with multiple industry certifications including ISO 9001 and CE Marking.
Frequently Asked Questions
Q1: Can the XC7Z045-1FFG676C be used in high-temperature environments?
A1: Yes, it can operate effectively between -40°C and +85°C, making it suitable for industrial settings that require robust performance under extreme conditions.
Q2: What kind of memory does the XC7Z045-1FFG676C support?
A2: The XC7Z045-1FFG676C supports DDR4 memory, which enhances its ability to handle large datasets efficiently.
Q3: In which specific scenarios would you recommend using the XC7Z045-1FFG676C?
A3: This device is recommended for scenarios requiring high-speed data processing and analysis, such as real-time data streaming in financial markets or predictive analytics in healthcare.
Other people’s search terms
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