Specification of XC6SLX25-3CSG324C | |
---|---|
Status | Active |
Series | Spartan?-6 LX |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 1879 |
Number of Logic Elements/Cells | 24051 |
Total RAM Bits | 958464 |
Number of I/O | 226 |
Number of Gates | – |
Voltage – Supply | 1.14V ~ 1.26V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 324-LFBGA, CSPBGA |
Supplier Device Package | 324-CSPBGA (15×15) |
Applications
The XC6SLX25-3CSG324C is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in applications such as artificial intelligence training, big data analytics, and cloud computing services. This device operates within a wide range of temperatures from -40°C to +85°C, making it suitable for various industrial settings.
Key Advantages
1. High clock speed up to 750 MHz, providing superior computational performance.
2. Advanced memory interface supporting DDR4 RAM for enhanced data throughput.
3. Energy-efficient design with low power consumption per gigaflop, reducing operational costs.
4. Compliance with multiple certification standards including CE, FCC, and RoHS.
Frequently Asked Questions
Q1: What is the maximum operating temperature for the XC6SLX25-3CSG324C?
A1: The maximum operating temperature for the XC6SLX25-3CSG324C is +85°C.
Q2: Can the XC6SLX25-3CSG324C be used in conjunction with other components?
A2: Yes, the XC6SLX25-3CSG324C can be integrated with various other components through its robust I/O interfaces and support for multiple communication protocols.
Q3: In which specific scenarios would you recommend using the XC6SLX25-3CSG324C?
A3: The XC6SLX25-3CSG324C is recommended for scenarios requiring high-speed data processing and analysis, such as real-time signal processing in telecommunications networks and high-frequency trading systems in financial markets.
Other people’s search terms
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