XC6SLX16-3FTG256C

Applications

The XC6SLX16-3FTG256C is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and large-scale scientific simulations. This device supports operating temperatures ranging from -40°C to +85°C, making it suitable for various industrial settings.

Key Advantages

1. High clock speed up to 750 MHz, providing superior computational performance.

2. Advanced memory interface supporting DDR4 at speeds up to 2666 MT/s, enhancing data throughput.

3. Energy-efficient design with power consumption optimized for extended operation without overheating.

4. Meets stringent industry certifications including CE, FCC, and RoHS compliance.

Frequently Asked Questions

Q1: What is the maximum operating temperature supported by the XC6SLX16-3FTG256C?

A1: The XC6SLX16-3FTG256C operates within a temperature range of -40°C to +85°C, ensuring reliability across diverse environments.

Q2: Can the XC6SLX16-3FTG256C be used in conjunction with other components for system integration?

A2: Yes, the XC6SLX16-3FTG256C is designed to integrate seamlessly with various other components, facilitating easy system assembly and optimization.

Q3: In which specific scenarios would the XC6SLX16-3FTG256C be most beneficial?

A3: The XC6SLX16-3FTG256C is particularly beneficial in scenarios requiring high-speed data processing and analysis, such as real-time data streaming, machine learning algorithms, and complex simulation tasks.

Other people’s search terms

– High-performance computing solutions

– DDR4 memory support

– Industrial-grade temperature range

– Energy-efficient FPGA

– Compliance certifications for XC6SLX16-3FTG256C