Specification of XC6VSX315T-1FF1156I | |
---|---|
Status | Active |
Series | Virtex?-6 SXT |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 24600 |
Number of Logic Elements/Cells | 314880 |
Total RAM Bits | 25952256 |
Number of I/O | 600 |
Number of Gates | – |
Voltage – Supply | 0.95V ~ 1.05V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 1156-BBGA, FCBGA |
Supplier Device Package | 1156-FCBGA (35×35) |
Applications
The XC6VSX315T-1FF1156I is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in data centers where it handles large-scale data processing tasks efficiently. Additionally, it is suitable for automotive applications requiring robust and reliable performance under varying conditions.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Unique Architecture Feature: Advanced parallel processing architecture
3. Power Efficiency: 1.5W per core at 1GHz
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: What is the maximum operating temperature of the XC6VSX315T-1FF1156I?
A1: The maximum operating temperature of the XC6VSX315T-1FF1156I is +85°C.
Q2: Can the XC6VSX315T-1FF1156I be used in automotive applications?
A2: Yes, the XC6VSX315T-1FF1156I can be used in automotive applications due to its reliability and robust design.
Q3: In which specific scenarios would you recommend using the XC6VSX315T-1FF1156I?
A3: The XC6VSX315T-1FF1156I is recommended for scenarios involving high-speed data processing, such as real-time analytics in financial markets and autonomous vehicle navigation systems.
Other people’s search terms
– High-performance computing solutions
– Automotive-grade processors
– Robust data center components
– Efficient parallel processing chips
– Certified automotive processors