Specification of XCKU11P-2FFVE1517E | |
---|---|
Status | Active |
Series | Kintex? UltraScale+? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 37320 |
Number of Logic Elements/Cells | 653100 |
Total RAM Bits | 53964800 |
Number of I/O | 512 |
Number of Gates | – |
Voltage – Supply | 0.825V ~ 0.876V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 1517-BBGA, FCBGA |
Supplier Device Package | 1517-FCBGA (40×40) |
Applications
The XCKU11P-2FFVE1517E is ideal for high-performance computing environments such as data centers and cloud servers. It excels in applications requiring fast processing speeds, like artificial intelligence training, big data analytics, and scientific simulations. This device operates within a wide temperature range from -40°C to +85°C, ensuring reliability across various climates.
Key Advantages
1. High clock speed up to 3 GHz, providing superior computational performance.
2. Advanced power management system that reduces energy consumption by up to 20% compared to similar products.
3. The device supports up to 64 GB of DDR5 memory, enhancing its capacity for large-scale data processing tasks.
4. Meets stringent industry certifications including CE, FCC, and RoHS, ensuring compliance with international standards.
Frequently Asked Questions
Q1: Can the XCKU11P-2FFVE1517E be used in environments with extreme temperatures?
A1: Yes, it can operate effectively between -40°C and +85°C due to its robust design and advanced thermal management features.
Q2: What is the maximum memory capacity supported by the XCKU11P-2FFVE1517E?
A2: The XCKU11P-2FFVE1517E supports up to 64 GB of DDR5 memory, making it suitable for demanding memory-intensive applications.
Q3: In which specific scenarios would the XCKU11P-2FFVE1517E be most beneficial?
A3: This device is particularly beneficial in high-performance computing tasks such as AI model training, big data analysis, and complex simulation projects where high-speed processing and large memory capacities are crucial.
Other people’s search terms
– High-performance computing solutions
– DDR5 memory support
– Extreme temperature operation
– Energy-efficient processor
– Industry-standard certifications