Specification of XC7Z010-1CLG225C | |
---|---|
Status | Active |
Series | Zynq?-7000 |
Package | Tray |
Supplier | AMD |
Architecture | MCU, FPGA |
Core Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
Flash Size | – |
RAM Size | 256KB |
Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 667MHz |
Primary Attributes | Artix-7 FPGA, 28K Logic Cells |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 225-LFBGA, CSPBGA |
Supplier Device Package | 225-CSPBGA (13×13) |
Applications
The XC7Z010-1CLG225C is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and large-scale scientific simulations. This device operates within a wide range of temperatures from -40°C to +85°C, making it suitable for various industrial settings.
Key Advantages
1. High clock speed up to 667 MHz, providing superior computational performance.
2. Advanced memory interface supporting DDR3 SDRAM, enhancing data throughput.
3. Low power consumption, reducing operational costs significantly.
4. Compliant with multiple industry certifications ensuring reliability and safety.
Frequently Asked Questions
Q1: Can the XC7Z010-1CLG225C be used in extreme temperature conditions?
A1: Yes, it can operate effectively between -40°C and +85°C, making it suitable for harsh environments.
Q2: What kind of memory does it support?
A2: The XC7Z010-1CLG225C supports DDR3 SDRAM, which is crucial for high-speed data processing tasks.
Q3: In which specific scenarios would you recommend using this XC7Z010-1CLG225C?
A3: This device is recommended for applications requiring high computational power and reliability, such as financial trading systems, medical imaging, and automotive control systems.
Other people’s search terms
– High-performance computing solutions
– Industrial-grade FPGA devices
– DDR3 SDRAM supported FPGAs
– Low-power FPGA options
– Certified industrial FPGAs