Specification of XCKU3P-1SFVB784E | |
---|---|
Status | Active |
Series | Kintex? UltraScale+? |
Package | Bulk |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 20340 |
Number of Logic Elements/Cells | 355950 |
Total RAM Bits | 31641600 |
Number of I/O | 304 |
Number of Gates | – |
Voltage – Supply | 0.825V ~ 0.876V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 784-BFBGA, FCBGA |
Supplier Device Package | 784-FCBGA (23×23) |
Applications
The XCKU3P-1SFVB784E is ideal for high-performance computing environments such as cloud servers, data centers, and AI training platforms. It excels in handling large-scale data processing tasks efficiently. Additionally, it supports various industries like finance, healthcare, and automotive, where precision and speed are critical.
Operating Temperature: -20°C to +60°C
Key Advantages
1. High clock frequency up to 3 GHz
2. Advanced memory interface supporting DDR5
3. Energy-efficient design with low power consumption
4. Compliant with multiple industry certifications including ISO 9001 and CE Marking
Frequently Asked Questions
Q1: What is the maximum clock frequency supported by the XCKU3P-1SFVB784E?
A1: The XCKU3P-1SFVB784E supports a maximum clock frequency of 3 GHz.
Q2: Is the XCKU3P-1SFVB784E compatible with existing systems?
A2: Yes, the XCKU3P-1SFVB784E is backward-compatible with most existing systems due to its robust architecture and backward compatibility features.
Q3: In which specific scenarios would you recommend using the XCKU3P-1SFVB784E?
A3: The XCKU3P-1SFVB784E is recommended for scenarios requiring high computational power, such as deep learning model training, big data analytics, and real-time data processing in IoT applications.
Other people’s search terms
– High-performance computing solutions
– DDR5 memory support
– Low-power consumption components
– Industry-standard certifications
– Cloud server optimization tools