| Specification of XCVU9P-1FLGB2104E | |
|---|---|
| Status | Active |
| Series | Virtex? UltraScale+? |
| Package | Tray |
| Supplier | AMD |
| Digi-Key Programmable | Not Verified |
| Number of LABs/CLBs | 147780 |
| Number of Logic Elements/Cells | 2586150 |
| Total RAM Bits | 391168000 |
| Number of I/O | 702 |
| Number of Gates | – |
| Voltage – Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C ~ 100C (TJ) |
| Package / Case | 2104-BBGA, FCBGA |
| Supplier Device Package | 2104-FCBGA (47.5×47.5) |
Applications
The XCVU9P-1FLGB2104E is ideal for high-performance computing environments such as data centers and cloud computing platforms. It excels in applications requiring fast processing speeds and large-scale parallel computing tasks. Additionally, it is suitable for automotive electronics systems due to its robustness and reliability under various environmental conditions.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Advanced Architecture Design
3. Energy Efficiency Rating: 0.6W/MHz
4. Compliance with Industry Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: What is the maximum operating temperature of the XCVU9P-1FLGB2104E?
A1: The maximum operating temperature of the XCVU9P-1FLGB2104E is +85°C.
Q2: Can the XCVU9P-1FLGB2104E be used in automotive applications?
A2: Yes, the XCVU9P-1FLGB2104E is designed with automotive-grade specifications, ensuring reliability and safety in harsh environments.
Q3: In which specific scenarios would the XCVU9P-1FLGB2104E be most beneficial?
A3: The XCVU9P-1FLGB2104E is particularly beneficial in scenarios requiring high-speed data processing, such as real-time signal processing in telecommunications networks and high-frequency trading in financial markets.
Other people’s search terms
– High-performance computing solutions
– Automotive-grade FPGA
– Data center FPGA
– Cloud computing FPGA
– Fast processing FPGAs
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