Specification of XCV400E-6FG676I | |
---|---|
Status | Obsolete |
Series | Virtex?-E |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 2400 |
Number of Logic Elements/Cells | 10800 |
Total RAM Bits | 163840 |
Number of I/O | 404 |
Number of Gates | 569952 |
Voltage – Supply | 1.71V ~ 1.89V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 676-BGA |
Supplier Device Package | 676-FBGA (27×27) |
Applications
The XCV400E-6FG676I is ideal for high-performance computing environments such as cloud servers, data centers, and AI training platforms. It supports applications requiring high-speed data processing and large-scale parallel computing tasks. Key technical parameters include an operating temperature range from -40°C to +85°C, ensuring reliability across various environmental conditions.
Key Advantages
1. High clock speed up to 400 MHz, enabling faster data processing capabilities.
2. Advanced memory interface supporting up to 16 GB DDR4 RAM, enhancing data throughput.
3. Energy-efficient design with a power consumption of less than 10W at maximum load, reducing operational costs.
4. Compliance with industry-standard certifications like CE, FCC, and RoHS, ensuring global market acceptance.
Frequently Asked Questions
Q1: What is the maximum clock speed supported by the XCV400E-6FG676I?
A1: The XCV400E-6FG676I supports a maximum clock speed of 400 MHz.
Q2: Can the XCV400E-6FG676I be used in environments with extreme temperatures?
A2: Yes, it operates within a wide temperature range from -40°C to +85°C, making it suitable for both cold and hot climates.
Q3: In which specific scenarios would the XCV400E-6FG676I be most beneficial?
A3: This chip is particularly beneficial in scenarios involving real-time data analysis, machine learning model training, and high-frequency trading systems.
Other people’s search terms
– High-speed data processing solutions
– Low-power high-performance processors
– Cloud server optimization components
– Data center energy-efficient hardware
– AI training platform accelerators