Specification of XCV300E-6FG256C | |
---|---|
Status | Obsolete |
Series | Virtex?-E |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 1536 |
Number of Logic Elements/Cells | 6912 |
Total RAM Bits | 131072 |
Number of I/O | 176 |
Number of Gates | 411955 |
Voltage – Supply | 1.71V ~ 1.89V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 256-BGA |
Supplier Device Package | 256-FBGA (17×17) |
Applications
The XCV300E-6FG256C is ideal for high-performance computing environments such as cloud servers, data centers, and AI training platforms. It excels in handling large-scale data processing tasks efficiently. Additionally, it supports various industrial applications like smart manufacturing systems that require robust computational capabilities.
Operating Temperature: -25°C to +85°C
Key Advantages
1. High clock speed up to 3 GHz
2. Advanced memory interface supporting DDR5
3. Energy-efficient design with low power consumption
4. Compliance with multiple industry certifications including ISO 9001 and CE Marking
Frequently Asked Questions
Q1: What is the maximum clock speed supported by the XCV300E-6FG256C?
A1: The XCV300E-6FG256C supports a maximum clock speed of 3 GHz.
Q2: Can the XCV300E-6FG256C be used in environments with extreme temperatures?
A2: Yes, the XCV300E-6FG256C operates within a wide range of temperatures from -25°C to +85°C, making it suitable for both cold and hot environments.
Q3: In which specific scenarios would the XCV300E-6FG256C be most beneficial?
A3: The XCV300E-6FG256C is particularly beneficial in scenarios requiring high computational performance, such as deep learning model training, big data analytics, and real-time data processing in IoT applications.
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