Specification of XC6VLX365T-2FFG1156C | |
---|---|
Status | Active |
Series | Virtex?-6 LXT |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 28440 |
Number of Logic Elements/Cells | 364032 |
Total RAM Bits | 15335424 |
Number of I/O | 600 |
Number of Gates | – |
Voltage – Supply | 0.95V ~ 1.05V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 1156-BBGA, FCBGA |
Supplier Device Package | 1156-FCBGA (35×35) |
Applications
The XC6VLX365T-2FFG1156C is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in applications such as artificial intelligence training, big data analytics, and scientific simulations. This device operates within a wide range of temperatures from -40°C to +85°C, making it suitable for various industrial settings.
Key Advantages
1. High clock speed up to 750 MHz, providing superior computational performance.
2. Advanced parallel processing architecture that enhances data throughput.
3. Energy-efficient design with low power consumption per gigaflop.
4. Meets stringent industry certifications including ISO 9001 and CE marking.
Frequently Asked Questions
Q1: Can the XC6VLX365T-2FFG1156C be used in extreme temperature conditions?
A1: Yes, it can operate effectively between -40°C and +85°C, ensuring reliability in harsh environments.
Q2: What are the compatibility requirements for this device?
A2: The XC6VLX365T-2FFG1156C is compatible with a variety of operating systems and hardware configurations, including Linux, Windows, and various motherboards designed for high-speed processing.
Q3: In which specific scenarios would you recommend using this XC6VLX365T-2FFG1156C?
A3: This device is recommended for scenarios requiring high-speed data processing, such as real-time analysis in financial markets, predictive maintenance in manufacturing plants, and complex simulation tasks in research facilities.
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