XC6SLX25-3FGG484C

Applications

The XC6SLX25-3FGG484C is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and large-scale scientific simulations. This device supports operating temperatures ranging from -40°C to +85°C, making it suitable for various industrial settings.

Key Advantages

1. High clock speed up to 750 MHz, providing superior computational performance.

2. Advanced memory interface supporting DDR4 at speeds up to 2666 MT/s, enhancing data throughput.

3. Energy-efficient design with power consumption optimized for extended operation without overheating.

4. Compliance with multiple certification standards including CE, FCC, and RoHS, ensuring global market acceptance.

Frequently Asked Questions

Q1: Can the XC6SLX25-3FGG484C operate effectively in extreme temperatures?

A1: Yes, it operates within a wide temperature range (-40°C to +85°C), making it suitable for both indoor and outdoor applications requiring robust performance under varying conditions.

Q2: What are the specific memory configurations supported by the XC6SLX25-3FGG484C?

A2: The XC6SLX25-3FGG484C supports dual-channel DDR4 memory configurations, allowing for scalable memory bandwidth and improved system performance.

Q3: In which industries is the XC6SLX25-3FGG484C commonly used?

A3: Commonly used in telecommunications infrastructure, automotive electronics, and aerospace systems where high reliability and performance are critical.

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