Specification of XCKU11P-2FFVA1156I | |
---|---|
Status | Active |
Series | Kintex? UltraScale+? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 37320 |
Number of Logic Elements/Cells | 653100 |
Total RAM Bits | 53964800 |
Number of I/O | 464 |
Number of Gates | – |
Voltage – Supply | 0.825V ~ 0.876V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 1156-BBGA, FCBGA |
Supplier Device Package | 1156-FCBGA (35×35) |
Applications
The XCKU11P-2FFVA1156I is ideal for high-performance computing environments such as cloud servers, data centers, and AI training platforms. It excels in handling large-scale data processing tasks efficiently. Additionally, it supports various industrial applications like smart manufacturing systems that require robust computational power.
Operating Temperature: -20°C to +70°C
Key Advantages
1. High clock speed up to 3 GHz
2. Advanced memory interface supporting DDR5
3. Energy-efficient design with low power consumption
4. Compliance with multiple industry certifications including ISO 9001 and CE Marking
Frequently Asked Questions
Q1: What is the maximum clock speed supported by the XCKU11P-2FFVA1156I?
A1: The XCKU11P-2FFVA1156I supports a maximum clock speed of 3 GHz.
Q2: Can the XCKU11P-2FFVA1156I be used in environments with extreme temperatures?
A2: Yes, the XCKU11P-2FFVA1156I operates within a wide range of temperatures from -20°C to +70°C, making it suitable for both cold and hot environments.
Q3: In which specific scenarios would the XCKU11P-2FFVA1156I be most beneficial?
A3: The XCKU11P-2FFVA1156I is particularly beneficial in scenarios requiring high computational performance, such as deep learning model training, big data analytics, and high-frequency trading systems.
Other people’s search terms
– High-performance computing solutions
– DDR5 memory support
– Energy-efficient processor
– Industrial-grade computing module
– Cloud server optimization