XCVU13P-2FHGA2104I

Applications

The XCVU13P-2FHGA2104I is ideal for high-performance computing environments such as data centers, where it can handle large-scale data processing tasks efficiently. It also excels in automotive applications, particularly in advanced driver assistance systems (ADAS), where its robustness under various environmental conditions is crucial. Additionally, it finds application in telecommunications infrastructure, supporting complex network protocols and ensuring reliable communication services.

Key Advantages

1. Operating Temperature Range: -40°C to +85°C
2. Unique Architecture Feature: Advanced multi-core processing capabilities
3. Power Efficiency Data: 1.5W per gigaflop
4. Certification Standards: CE, FCC, RoHS

Frequently Asked Questions

Q1: Can the XCVU13P-2FHGA2104I operate effectively at extreme temperatures?

A1: Yes, it operates within a wide range from -40°C to +85°C, making it suitable for both cold and hot environments.

Q2: Is the XCVU13P-2FHGA2104I compatible with existing hardware?

A2: The chip is backward-compatible with previous models but offers enhanced performance and features that may require updates to software and firmware.

Q3: In which specific scenarios would you recommend using the XCVU13P-2FHGA2104I?

A3: This chip is recommended for scenarios requiring high computational power and reliability, such as real-time data analysis in financial markets, autonomous vehicle navigation, and critical medical imaging systems.

Other people’s search terms

– High-performance computing solutions
– Automotive electronics components
– Telecommunications network processors
– Robust embedded systems
– Advanced driver assistance systems (ADAS)