XC7K325T-2FFG676C

Applications

The XC7K325T-2FFG676C is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and artificial intelligence training models. This device supports a wide range of operating temperatures from -40°C to +85°C, ensuring reliability across various environmental conditions.

Key Advantages

1. High clock speed up to 300 MHz, providing superior computational performance.

2. Advanced memory interface supporting DDR4 at speeds up to 2666 MT/s, enhancing data throughput.

3. Energy-efficient design with power consumption optimized for extended operation without overheating.

4. Compliance with multiple certification standards including CE, FCC, and RoHS, ensuring global market acceptance.

Frequently Asked Questions

Q1: Can the XC7K325T-2FFG676C operate effectively in extreme temperatures?

A1: Yes, it operates within a broad temperature range (-40°C to +85°C), making it suitable for both indoor and outdoor applications.

Q2: What are the specific memory interfaces supported by the XC7K325T-2FFG676C?

A2: The device supports DDR4 memory interfaces, which can run at speeds up to 2666 MT/s, significantly improving data transfer rates.

Q3: In which industries is the XC7K325T-2FFG676C commonly used?

A3: Commonly used in data centers, cloud computing platforms, and AI model training, leveraging its high-speed processing and energy-efficient design.

Other people’s search terms

– High-performance computing solutions

– DDR4 memory support devices

– Temperature-resistant FPGA solutions

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– Certified FPGA modules for global markets