Specification of XC7K160T-2FBG676I | |
---|---|
Status | Active |
Series | Kintex?-7 |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 12675 |
Number of Logic Elements/Cells | 162240 |
Total RAM Bits | 11980800 |
Number of I/O | 400 |
Number of Gates | – |
Voltage – Supply | 0.97V ~ 1.03V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 676-BBGA, FCBGA |
Supplier Device Package | 676-FCBGA (27×27) |
Applications
The XC7K160T-2FBG676I is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in applications such as artificial intelligence training, big data analytics, and cloud computing services. This FPGA offers a wide operating temperature range from -40°C to +85°C, making it suitable for industrial settings.
Key Advantages
1. High-speed data processing at up to 1.2 GHz clock speed.
2. Advanced embedded memory blocks supporting up to 1 MB of SRAM.
3. Low power consumption of only 15W under typical operating conditions.
4. Compliance with industry-standard certifications like ISO 9001 and CE marking.
Frequently Asked Questions
Q1: Can the XC7K160T-2FBG676I be used in high-temperature environments?
A1: Yes, the XC7K160T-2FBG676I operates within a temperature range of -40°C to +85°C, making it suitable for high-temperature environments.
Q2: What is the maximum power consumption of the XC7K160T-2FBG676I?
A2: The maximum power consumption of the XC7K160T-2FBG676I is 15W under typical operating conditions.
Q3: In which specific scenarios can the XC7K160T-2FBG676I be utilized effectively?
A3: The XC7K160T-2FBG676I is particularly effective in scenarios requiring high computational performance, such as deep learning model training, large-scale data processing tasks, and cloud-based computing solutions.
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