Specification of XC6SLX150T-3FGG676C | |
---|---|
Status | Active |
Series | Spartan?-6 LXT |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 11519 |
Number of Logic Elements/Cells | 147443 |
Total RAM Bits | 4939776 |
Number of I/O | 396 |
Number of Gates | – |
Voltage – Supply | 1.14V ~ 1.26V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 676-BGA |
Supplier Device Package | 676-FBGA (27×27) |
Applications
The XC6SLX150T-3FGG676C is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It supports applications requiring high computational power like machine learning models, big data processing, and scientific simulations. This device operates within a wide temperature range from -40°C to +85°C, making it suitable for various industrial settings.
Key Advantages
1. High clock speed up to 500 MHz, providing superior performance for complex tasks.
2. Advanced memory interface supporting DDR4 RAM for faster data transfer rates.
3. Energy-efficient design with low power consumption per gigaflop, reducing operational costs.
4. Meets stringent industry certifications including CE, FCC, and RoHS compliance.
Frequently Asked Questions
Q1: Can this XC6SLX150T-3FGG676C be used in environments with extreme temperatures?
A1: Yes, it can operate effectively between -40°C and +85°C due to its robust thermal management system.
Q2: Is there any specific hardware requirement when using this chip?
A2: The XC6SLX150T-3FGG676C requires compatible motherboards that support its advanced features and power requirements.
Q3: In which specific scenarios would this XC6SLX150T-3FGG676C be most beneficial?
A3: This chip excels in scenarios involving large-scale data analysis, real-time processing, and high-frequency trading systems where rapid computation is crucial.
Other people’s search terms
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