Specification of XC6VLX195T-2FFG1156I | |
---|---|
Status | Active |
Series | Virtex?-6 LXT |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 15600 |
Number of Logic Elements/Cells | 199680 |
Total RAM Bits | 12681216 |
Number of I/O | 600 |
Number of Gates | – |
Voltage – Supply | 0.95V ~ 1.05V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 1156-BBGA, FCBGA |
Supplier Device Package | 1156-FCBGA (35×35) |
Applications
The XC6VLX195T-2FFG1156I is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in applications such as artificial intelligence training, big data analytics, and cloud computing services. This device operates within a wide range of temperatures from -40°C to +85°C, ensuring reliability across various environmental conditions.
Key Advantages
1. High clock speed up to 750 MHz, providing superior computational performance.
2. Advanced memory interface supporting DDR4 at speeds up to 2666 MT/s, enhancing data throughput.
3. Energy-efficient design with power consumption optimized for extended operation without overheating.
4. Meets stringent industrial certification standards including CE, FCC, and RoHS compliance.
Frequently Asked Questions
Q1: Can the XC6VLX195T-2FFG1156I be used in extreme temperature environments?
A1: Yes, it can operate effectively between -40°C and +85°C, making it suitable for both indoor and outdoor applications.
Q2: What are the specific memory configurations supported by this device?
A2: The XC6VLX195T-2FFG1156I supports dual-channel DDR4 memory with capacities ranging from 8GB to 128GB per channel.
Q3: In which industries is the XC6VLX195T-2FFG1156I commonly deployed?
A3: Commonly deployed in telecommunications, automotive electronics, and aerospace sectors where high-speed processing and reliability are critical.
Other people’s search terms
– High-performance computing solutions
– Artificial intelligence hardware accelerators
– Cloud computing infrastructure components
– Industrial-grade memory interfaces
– Energy-efficient processor architectures