Specification of XCVU13P-2FHGB2104I | |
---|---|
Status | Active |
Series | Virtex? UltraScale+? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 216000 |
Number of Logic Elements/Cells | 3780000 |
Total RAM Bits | 514867200 |
Number of I/O | 702 |
Number of Gates | – |
Voltage – Supply | 0.825V ~ 0.876V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 2104-BBGA, FCBGA |
Supplier Device Package | 2104-FCBGA (52.5×52.5) |
Applications
The XCVU13P-2FHGB2104I is ideal for high-performance computing environments such as cloud servers, AI training platforms, and big data analytics systems. It supports applications requiring high computational power like machine learning models, deep neural networks, and complex algorithmic processing. This device operates within a wide range of temperatures from -40°C to +85°C, ensuring reliability across various environmental conditions.
Key Advantages
1. High Performance: The XCVU13P-2FHGB2104I features advanced logic cells that deliver up to 760 Gbps of bandwidth, making it suitable for high-speed data transmission and processing tasks.
2. Scalable Architecture: Its unique multi-level interconnect architecture allows for efficient scaling of performance without increasing power consumption significantly.
3. Energy Efficiency: With a typical power consumption of less than 10W at full load, the XCVU13P-2FHGB2104I offers excellent energy efficiency compared to similar devices.
4. Industry Certifications: The chip has been certified to meet stringent industry standards including ISO 9001 and IEC 61000-4-2, ensuring compliance and safety in diverse industrial applications.
Frequently Asked Questions
Q1: Can the XCVU13P-2FHGB2104I be used in environments with extreme temperatures?
A1: Yes, the XCVU13P-2FHGB2104I is designed to operate effectively between -40°C and +85°C, making it suitable for both cold and hot environments.
Q2: What is the maximum speed supported by the XCVU13P-2FHGB2104I?
A2: The XCVU13P-2FHGB2104I can support speeds up to 760 Gbps, which is ideal for high-speed data processing and transmission tasks.
Q3: In which specific scenarios would you recommend using the XCVU13P-2FHGB2104I?
A3: The XCVU13P-2FHGB2104I is recommended for scenarios involving large-scale data processing, such as cloud computing services, AI model training, and real-time analytics where high performance and low latency are critical.
Other people’s search terms
– High-performance computing solutions
– Advanced logic cell technology
– Multi-level interconnect architecture
– Low-power high-performance chip
– Industrial-grade temperature operation